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PDF MBRA2H100T3G Data sheet ( Hoja de datos )
| Número de pieza | MBRA2H100T3G | |
| Descripción | Surface Mount Schottky Power Rectifier SMA/SMB Power Surface Mount Package | |
| Fabricantes | ON Semiconductor | |
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MBRS2H100T3G,
MBRA2H100T3G
Surface Mount
Schottky Power Rectifier
SMA/SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−silicon power rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guard−Ring for Overvoltage Protection
• Low Forward Voltage Drop
• This is a Pb−Free Device
Mechanical Characteristics
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 70 mg (SMA), 95 mg (SMB) (Approximately)
• Cathode Polarity Band
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• ESD Ratings: Machine Model = C, Human Body Model = 3B
• Device Meets MSL1 Requirements
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 100 VOLTS
MARKING
DIAGRAMS
SMA
CASE 403D
PLASTIC
AYWW
A210G
G
SMB
CASE 403A
PLASTIC
AYWW
B210G
G
A210 = MBRA2H100T3G
B210 = MBRS2H100T3G
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MBRA2H100T3G SMA 5000 / Tape & Reel
(Pb−Free)
MBRS2H100T3G SMB 2500 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
March, 2009 − Rev. 5
www.DataSheet.in
1
Publication Order Number:
MBRS2H100/D
1 page  
MBRS2H100T3G, MBRA2H100T3G
TYPICAL CHARACTERISTICS
1000
50% (DUTY CYCLE)
100 20%
10%
5.0%
10 2.0%
1.0%
1.0
0.1
SINGLE PULSE
0.01
0.000001 0.00001
0.0001
0.001
0.01
SMB Die X 1.8 mm Die Y 1.8 mm
PCB Cu Area 11.8 mm2 PCB Cu thk 1.0 oz
0.1 1.0 10
100 1000
PULSE TIME (s)
Figure 10. Thermal Response, Junction−to−Ambient (min pad) − MBRS2H100
100
50% (DUTY CYCLE)
20%
10 10%
5.0%
2.0%
1.0
1.0%
0.1
0.01 SINGLE PULSE
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1 1.0 10
PULSE TIME (s)
Figure 11. Thermal Response, Junction−to−Ambient (1 inch pad) − MBRA2H100
100
1000
1000
50% (DUTY CYCLE)
100 20%
10%
5.0%
10 2.0%
1.0 1.0%
0.1
SINGLE PULSE
0.01
0.000001 0.00001
0.0001
0.001
0.01
0.1 1.0 10
PULSE TIME (s)
Figure 12. Thermal Response, Junction−to−Ambient (min pad) − MBRA2H100
100
1000
www.DataSheet.in
http://onsemi.com
5
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet MBRA2H100T3G.PDF ] | |
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