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MBD770DWT1G fiches techniques PDF

ON Semiconductor - (MBDxx0DWT1G) Dual Schottky Barrier Diodes

Numéro de référence MBD770DWT1G
Description (MBDxx0DWT1G) Dual Schottky Barrier Diodes
Fabricant ON Semiconductor 
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MBD770DWT1G fiche technique
MBD110DWT1G,
MBD330DWT1G,
MBD770DWT1G
Preferred Device
Dual Schottky Barrier
Diodes
Application circuit designs are moving toward the consolidation of
device count and into smaller packages. The new SOT363 package is
a solution which simplifies circuit design, reduces device count, and
reduces board space by putting two discrete devices in one small
sixleaded package. The SOT363 is ideal for lowpower surface
mount applications where board space is at a premium, such as
portable products.
Surface Mount Comparisons:
Area (mm2)
Max Package PD (mW)
Device Count
SOT363
4.6
120
2
SOT23
7.6
225
1
Space Savings:
Package
SOT363
1  SOT23
40%
2  SOT23
70%
The MBD110DW, MBD330DW, and MBD770DW devices are
spinoffs of our popular MMBD101LT1, MMBD301LT1, and
MMBD701LT1 SOT23 devices. They are designed for
highefficiency UHF and VHF detector applications. Readily
available to many other fast switching RF and digital applications.
Features
Extremely Low Minority Carrier Lifetime
Very Low Capacitance
Low Reverse Leakage
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Reverse Voltage
MBD110DWT1G
MBD330DWT1G
MBD770DWT1G
VR
7.0 V
30
70
Forward Power Dissipation TA = 25°C PF 120 mW
Junction Temperature
TJ 55 to +125 °C
Storage Temperature Range
Tstg 55 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
Anode 1
N/C 2
Cathode 3
6 Cathode
5 N/C
4 Anode
1
SC88 / SOT363
CASE 419B
STYLE 6
MARKING DIAGRAM
6
xx M G
G
1
xx = Device Code
Refer to Ordering Table,
page 2
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2009
October, 2009 Rev. 6
www.DataSheet.in
1
Publication Order Number:
MBD110DWT1/D

PagesPages 6
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