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PDF TCD2950D Data sheet ( Hoja de datos )

Número de pieza TCD2950D
Descripción Image SensorCCD
Fabricantes Toshiba Semiconductor 
Logotipo Toshiba Semiconductor Logotipo



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No Preview Available ! TCD2950D Hoja de datos, Descripción, Manual

Preliminary TOSHIBA CCD Image SensorCCD (charge coupled device)
TCD2950D
TCD2950D
The TCD2950D is a high sensitive and low dark current 10680
elements × 6 line CCD color image sensor which includes CCD
drive circuit and clamp circuit. The sensor is designed for
scanner.
The device contains a row of 10680 elements × 6 line staggered
photodiodes which provide a 96 lines/mm (2400DPI) across a A4
size paper. The device is operated by 5 V pulse, and 12 V power
supply.
Features
· Number of image sensing elements: 10680 elements × 6 line
Weight: 5.2 g (typ.)
· Image sensing element size: 2.8 µm by 4 mm on 4 µm centers
· Photo sensing region: High sensitive and low dark current PN photodiode
· Distance between photodiode array: 64 µm (16 lines)
· Clock: 2 phase (5 V)
· Power supply: 12 V power supply voltage
· Internal circuit: Clamp circuit
· Package: 22 pin CERDIP package
Pin Connections (top view)
· Color filter: Red, green, blue
OS3 1
22 OS2
Maximum Ratings (Note1)
Characteristics
Symbol
Rating
Clock pulse voltage
Shift pulse voltage
Reset pulse voltage
Clamp pulse voltage
Power supply voltage
Operating temperature
Storage temperature
VB
VSH
VRS
VCP
VOD
Topr
Tstg
-0.3~8.0
-0.3~15
0~60
-25~85
Note1: All voltage are with respect to SS terminals (ground).
Unit
V
V
°C
°C
SS 2
RS 3
SS 4
NC 5
f1A1 6
f2A1 7
f2A2 8
f1A2 9
SH3 10
SS 11
21 OS1
20 OD
19 CP
18 SS
17 f1A4
16 f2A4
15 f2A3
14 f1A3
13 SH1
12 SH2
www.DataSheet.in
1 2002-01-31

1 page




TCD2950D pdf
Operating Condition
Characteristics
Symbol
Min
Typ.
Max
Clock pulse voltage
Shift pulse voltage
Reset pulse voltage
Clamp pulse voltage
Power supply voltage
“H” level
“L” level
“H” level
“L” level
“H” level
“L” level
“H” level
“L” level
VBA
VSH
VRS
VCP
VOD
4.5
0
4.5
0
4.5
0
4.5
0
11.4
5.0
¾
5.0
¾
5.0
¾
5.0
¾
12.0
5.5
0.3
5.5
0.5
5.5
0.5
5.5
0.5
13.0
Clock Characteristics (Ta = 25°C)
Characteristics
Clock pulse frequency
Reset pulse frequency
Clamp pulse frequency
Clock capacitance
Shift gate capacitance
Reset gate capacitance
Clamp gate capacitance
(Note 11)
Note 11: VOD = 12 V
Symbol
fBA
f RS
f CP
CBA
CSH
CRS
CCP
Min Typ. Max Unit
0.15
0.3
0.3
¾
¾
¾
¾
1.0
2.0
2.0
400
50
10
10
10 MHz
10 MHz
10 MHz
¾ pF
¾ pF
¾ pF
¾ pF
TCD2950D
Unit Note
V
V
V
V
V
www.DataSheet.in
5 2002-01-31

5 Page





TCD2950D arduino
TCD2950D
Caution
1. Window Glass
The dust and stain on the glass window of the package degrade optical performance of CCD sensor.
Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and
allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or
thermal shock because the glass window is easily to damage.
2. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown.
CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static
electricity is sometimes detected. In handing the device, it is necessary to execute the following static
electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system
due to static electricity.
a. Prevent the generation of static electricity due to friction by making the work with bare hands or by
putting on cotton gloves and non-charging working clothes.
b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the
work room.
c. Ground the tools such as soldering iron, radio cutting pliers of or pincer.
It is not necessarily required to execute all precaution items for static electricity.
It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed
range.
3. Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and
PRNU of CCD sensor.
4. Lead Frame Forming
Since this package is not strong against mechanical stress, you should not reform the lead frame.
We recommend to use a IC-inserter when you assemble to PCB.
5. Soldering
Soldering by the solder flow method cannot be guaranteed because this method may have deleterious
effects on prevention of window glass soiling and heat resistance.
Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260°C, or
within three seconds for lead temperatures of up to 350°C.
www.DataSheet.in
11 2002-01-31

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