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PDF TJF1051 Data sheet ( Hoja de datos )
| Número de pieza | TJF1051 | |
| Descripción | High-speed CAN transceiver | |
| Fabricantes | NXP Semiconductors | |
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DataSheet.in
TJF1051
High-speed CAN transceiver
Rev. 01 — 10 August 2010
Product data sheet
1. General description
The TJF1051 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed (up to 1 Mbit/s) CAN industrial applications,
providing differential transmit and receive capability to (a microcontroller with) a CAN
protocol controller.
The TJF1051 is a step up from the TJA1050 high-speed CAN transceiver. It offers
improved ElectroMagnetic Compatibility (EMC) and ElectroStatic Discharge (ESD)
performance, and also features ideal passive behavior to the CAN bus when the supply
voltage is off.
The TJF1051 can be interfaced directly to microcontrollers with supply voltages from
3 V to 5 V
These features make the TJF1051 an excellent choice for all types of HS-CAN networks,
in nodes that do not require a standby mode with wake-up capability via the bus.
2. Features and benefits
2.1 General
Fully ISO 11898-2 compliant
Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
VIO input allows for direct interfacing with 3 V to 5 V microcontrollers
2.2 Low-power management
Functional behavior predictable under all supply conditions
Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
High ESD handling capability on the bus pins
Transmit Data (TXD) dominant time-out function
Undervoltage detection on pins VCC and VIO
Thermally protected
1 page  
DataSheet.in
NXP Semiconductors
TJF1051
High-speed CAN transceiver
6.2.3
Undervoltage detection on pins VCC and VIO
Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC)
and Vuvd (VIO); see Table 6), the transceiver will switch off and disengage from the bus
(zero load) until VCC and VIO have recovered.
6.2.4 Overtemperature protection
The output drivers are protected against overtemperature conditions. If the virtual junction
temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be
disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes
recessive again. Including the TXD condition ensures that output driver oscillations due to
temperature drift are avoided.
6.3 VIO supply pin
Pin VIO should be connected to the microcontroller supply voltage (see Figure 3). This
adjusts the signal levels on pins TXD, RXD and S to the I/O levels of the microcontroller.
7. Application design-in information
BAT 3 V
5V
CANH
CANL
CANH
CANL
VCC
VIO
TJF1051
S
TXD
RXD
GND
Fig 3. Typical application of the TJF1051
VDD
Pyy
MICRO-
TX0 CONTROLLER
RX0
GND
015aaa101
8. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter
Conditions
Min Max
Vx voltage on pin x
no time limit; DC value
on pins CANH and CANL
−58 +58
on any other pin
−0.3 +7
Unit
V
V
TJF1051
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 10 August 2010
© NXP B.V. 2010. All rights reserved.
5 of 16
5 Page 
DataSheet.in
NXP Semiconductors
TJF1051
High-speed CAN transceiver
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
TJF1051
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 10 August 2010
© NXP B.V. 2010. All rights reserved.
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