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PDF NTMFS4847N Data sheet ( Hoja de datos )

Número de pieza NTMFS4847N
Descripción Power MOSFET ( Transistor )
Fabricantes ON Semiconductor 
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No Preview Available ! NTMFS4847N Hoja de datos, Descripción, Manual

NTMFS4847N
www.DataSheet4U.com
Power MOSFET
30 V, 85 A, Single NChannel, SO8 FL
Features
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
Thermally Enhanced SO8 Package
These are PbFree Device
Applications
Refer to Application Note AND8195/D
CPU Power Delivery
DCDC Converters
Low Side Switching
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DraintoSource Voltage
GatetoSource Voltage
Continuous Drain
C(Nuortreen1t)RqJA
Power Dissipation
RqJA (Note 1)
Continuous Drain
Current
10 sec
RqJA
v
Power Dissipation
RqJA, t v 10 sec
Continuous Drain
C(Nuortreen2t)RqJA
Steady
State
Power Dissipation
RqJA (Note 2)
Continuous Drain
C(Nuortreen1t)RqJC
Power Dissipation
RqJC (Note 1)
Pulsed Drain
Current
tp=10ms
TA = 25°C
TA = 85°C
TA = 25°C
TA = 25°C
TA = 85°C
TA = 25°C
TA = 25°C
TA = 85°C
TA = 25°C
TC = 25°C
TC = 85°C
TC = 25°C
TA = 25°C
VDSS
VGS
ID
PD
ID
PD
ID
PD
ID
PD
IDM
30
±16
18
13
2.21
29.5
21
5.8
11.5
8.2
0.88
85
61
48.1
170
V
V
A
W
A
W
A
W
A
W
A
Current limited by package
TA = 25°C
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source dV/dt
Single Pulse DraintoSource Avalanche
Energy (VDD = 50 V, VGS = 10 V,
IL = 33 Apk, L = 0.3 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IDmaxpkg
TJ,
TSTG
IS
dV/dt
EAS
TL
100
55 to
+150
48
6
163
260
A
°C
A
V/ns
mJ
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
4.1 mW @ 10 V
6.2 mW @ 4.5 V
ID MAX
85 A
D (5,6)
G (4)
S (1,2,3)
NCHANNEL MOSFET
1
SO8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
S
S
4847N
AYWWG
D
GGD
D
A = Assembly Location
Y = Year
WW = Work Week
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
NTMFS4847NT1G SO8FL
(PbFree)
1500 /
Tape & Reel
NTMFS4847NT3G SO8FL
(PbFree)
5000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our PbFree strategy
and soldering details, please download the ON
Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2009
March, 2009 Rev. 1
1
Publication Order Number:
NTMFS4847N/D

1 page




NTMFS4847N pdf
1000
100
VDS = 15 V
ID = 15 A
VGS = 11.5 V
10
NTMFS4847N
TYPICAL CHARACTERISTICS
tf
td(off)
tr
td(on)
30
VGS = 0 V
25 TJ = 25°C
20
15
10
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5
1
1 10 100
RG, GATE RESISTANCE (W)
Figure 9. Resistive Switching Time Variation
vs. Gate Resistance
1000
100 10 ms
10
VGS = 20 V
Single Pulse
1 TC = 25°C
RDS(on) Limit
Thermal Limit
0.1 Package Limit
0.1 1
100 ms
1 ms
10 ms
dc
10 100
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
140
120
100
80
60
40
20
VDS = 1.5 V
0
0 15 30 45 60 75 90 105 120
DRAIN CURRENT (A)
Figure 13. gFS vs. Drain Current
0
0.4 0.5 0.6 0.7 0.8 0.9
VSD, SOURCETODRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage vs. Current
180
160 ID = 33 A
140
120
100
80
60
40
20
0
25 50 75 100 125 150
TJ, STARTING JUNCTION TEMPERATURE(°C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
100
125°C
100°C
25°C
10
1
1
10
100
1000
10,000
PULSE WIDTH (ms)
Figure 14. Id vs. Pulse Width
http://onsemi.com
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