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PDF PCF2120 Data sheet ( Hoja de datos )

Número de pieza PCF2120
Descripción Quartz oscillator
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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No Preview Available ! PCF2120 Hoja de datos, Descripción, Manual

PCF2120
Quartz oscillator
Rev. 01 — 5 February 2008
www.DataSheet4U.com
Product data sheet
1. General description
The PCF2120 is a CMOS quartz oscillator optimized for low power consumption.
The 32 kHz output signal is gated using an enable signal.
2. Features
I Clock operating voltage: 1.5 V to 5.5 V
I Low backup current: typical 0.85 µA at VDD = 3.0 V and Tamb = 25 °C
I 32.768 kHz output for peripheral devices
I Two integrated oscillator capacitors
I Push-pull output
I Internal power-on reset
3. Applications
I Portable instruments
I Industrial products
I Battery powered products
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter
Conditions
Min Typ Max Unit
VDD supply voltage
[1] 1.5 -
5.5 V
IDD supply current
clock output disabled
VDD = 2.0 V; Tamb = 25 °C
- 210 450 nA
VDD = 3.0 V;
Tamb = 40 °C to +85 °C
- 265 650 nA
clock output enabled at 32 kHz
VDD = 2.0 V; Tamb = 25 °C
- 615 900 nA
VDD = 3.0 V;
Tamb = 40 °C to +85 °C
Tstg storage temperature
- 875 1100 nA
65 -
+150 °C
[1] For reliable oscillator start-up at power-up: VDD > VDD(min) + 0.3 V.

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PCF2120 pdf
NXP Semiconductors
www.DataSheet4U.com
PCF2120
Quartz oscillator
11. Static characteristics
Table 5. Static characteristics
VDD = 1.5 V to 5.5 V; VSS = 0 V; Tamb = 40 °C to +85 °C; fosc = 32.768 kHz; quartz Rs = 40 k; CL = 8 pF; unless otherwise
specified.
Symbol Parameter
Conditions
Min Typ Max
Unit
Supply
VDD supply voltage
IDD supply current
clock output disabled
Tamb = 25 °C
VDD = 5.0 V
VDD = 3.0 V
VDD = 2.0 V
Tamb = 40 °C to +85 °C
VDD = 5.0 V
VDD = 3.0 V
VDD = 2.0 V
clock output enabled at 32 kHz
[1] 1.5
-
5.5
V
-
300 550
nA
-
235 500
nA
-
210 450
nA
-
345 750
nA
-
265 650
nA
-
230 600
nA
[2]
Inputs
Tamb = 25 °C
VDD = 5.0 V
VDD = 3.0 V
VDD = 2.0 V
Tamb = 40 °C to +85 °C
VDD = 5.0 V
VDD = 3.0 V
VDD = 2.0 V
-
1310 1700
nA
-
845 1100
nA
-
615 900
nA
-
1385 1700
nA
-
875 1100
nA
-
635 900
nA
Pin OSCI
VI input voltage
Pin CLKOE
0.5 -
VDD + 0.5 V
VI
VIL
VIH
ILI
Outputs
input voltage
LOW-level input voltage
HIGH-level input voltage
input leakage current
VI = VDD or VSS
0.5 -
--
0.7VDD -
1 0
VDD + 0.5 V
0.3VDD V
-V
+1 µA
Pin OSCO
VO
Pin CLKOUT
0.5 -
VDD + 0.5 V
VO output voltage
IOL LOW-level output current VOL = 0.4 V; VDD = 5 V
IOH HIGH-level output current VOH = 4.6 V; VDD = 5 V
ILO
output leakage current
VO = VDD or VSS
0.5 -
1 -
--
1 0
VDD + 0.5 V
- mA
1 mA
+1 µA
[1] For reliable oscillator start-up at power-up: VDD > VDD(min) + 0.3 V.
PCF2120_1
Product data sheet
Rev. 01 — 5 February 2008
© NXP B.V. 2008. All rights reserved.
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PCF2120 arduino
NXP Semiconductors
www.DataSheet4U.com
PCF2120
Quartz oscillator
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8 and 9
Table 8. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
220
Table 9. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
< 1.6
260 260
1.6 to 2.5
260 250
> 2.5
250 245
> 2000
260
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 11.
temperature
maximum peak temperature
= MSL limit, damage level
minimum peak temperature
= minimum soldering temperature
peak
temperature
PCF2120_1
Product data sheet
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
Rev. 01 — 5 February 2008
time
001aac844
© NXP B.V. 2008. All rights reserved.
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