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What is L3G4200DH?

This electronic component, produced by the manufacturer "ST Microelectronics", performs the same function as "MEMS motion sensor: three-axis digital output gyroscope".


L3G4200DH Datasheet PDF - ST Microelectronics

Part Number L3G4200DH
Description MEMS motion sensor: three-axis digital output gyroscope
Manufacturers ST Microelectronics 
Logo ST Microelectronics Logo 


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L3G4200DH
MEMS motion sensor:
three-axis digital output gyroscope
Preliminary data
Features
Three selectable full scales (250/500/2000
dps)
I2C/SPI digital output interface
16 bit-rate value data output
8-bit temperature data output
Two digital output lines (interrupt and data
ready)
Integrated low- and high-pass filters with user-
selectable bandwidth
Embedded self-test
Wide supply voltage: 2.4 V to 3.6 V
Low voltage-compatible IOs (1.8 V)
Embedded power-down and sleep mode
Embedded temperature sensor
96 levels of 16-bit data output (FIFO)
High shock survivability
Extended operating temperature range (-40 °C
to +85 °C)
ECOPACK® RoHS and “Green” compliant
(see Section 5)
Applications
Gaming and virtual reality input devices
Motion control with MMI (man-machine
interface)
GPS navigation systems
Appliances and robotics
LGA-16 (4x4x1.1 mm)
Description
The L3G4200DH is a low-power three-axis
angular rate sensor.
It includes a sensing element and an IC interface
capable of providing the measured angular rate to
the external world through a digital interface
(I2C/SPI).
The sensing element is manufactured using a
dedicated micro-machining process developed by
STMicroelectronics to produce inertial sensors
and actuators on silicon wafers.
The IC interface is manufactured using a CMOS
process that allows a high level of integration to
design a dedicated circuit which is trimmed to
better match the sensing element characteristics.
The L3G4200DH has a full scale of ±250/±500/
±2000 dps and is capable of measuring rates with
a user-selectable bandwidth.
The L3G4200DH is available in a plastic land grid
array (LGA) package and can operate within a
temperature range from -40 °C to +85 °C.
Table 1. Device summary
Order code
Temperature range (°C)
L3G4200DH
-40 to +85
L3G4200DHTR
-40 to +85
Package
LGA-16 (4x4x1.1 mm)
LGA-16 (4x4x1.1 mm)
Packing
Tray
Tape and reel
April 2010
Doc ID 17300 Rev 1
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/28
www.st.com
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L3G4200DH equivalent
L3G4200DH
List of figures
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List of figures
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Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
L3G4200DH external low-pass filter values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
I2C slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Bypass-to-stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trigger stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Multiple byte SPI read protocol (2-byte example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Multiple byte SPI write protocol (2-byte example). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
SPI read protocol in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
LGA-16: mechanical data and package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Doc ID 17300 Rev 1
5/28


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