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PDF LX3055 Data sheet ( Hoja de datos )

Número de pieza LX3055
Descripción Coplanar InGaAs/InP PIN Photo Diode
Fabricantes Microsemi 
Logotipo Microsemi Logotipo



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No Preview Available ! LX3055 Hoja de datos, Descripción, Manual

LX3055
TM ® Coplanar InGaAs/InP PIN Photo wDwiowd.DeataSheet4U.com
PRODUCTION DATA SHEET
DESCRIPTION
Microsemi’s InGaAs/InP PIN custom assembly configurations
Photo Diode chips are ideal for high including traditional wirebond or flip
bandwidth 1310nm and 1550nm chip assembly
optical networking applications.
This device is ideal for
The device series offers high manufacturers of optical receivers,
responsivity, low dark current, and transponders, optical transmission
high bandwidth for high performance modules and combination PIN photo
and low sensitivity receiver design. diode – transimpedance amplifier.
The LX3055 4 Gbps coplanar
waveguide photodiode is currently
offered in die form allowing
manufacturers the versatility of
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
PRODUCT HIGHLIGHT
ƒ Coplanar Design (gnd-signal-
gnd) 50characteristic
impedance
ƒ 125µm standard pad pitch for
ease of test
ƒ Large 75µm x 75µm pad size for
ease of packaging
ƒ Wire bond or Flip Chip capability
KEY FEATURES
ƒ LX3055 single die
ƒ Coplanar Waveguide , 50
ƒ High Responsivity
ƒ Low Dark Current
ƒ High Bandwidth
ƒ Anode/Cathode on
Illuminated Side
ƒ 125µm Pad pitch
ƒ Die good for bond wire or
flip chip applications
APPLICATIONS
ƒ 4 Gigabit Fiber Channel
ƒ 1310nm CATV Optical
Applications
ƒ SONET/SDH OC-48, ATM
ƒ 2.5Gb/s or 3.125Gb/s
Ethernet
ƒ 1310nm VCSEL receivers
ƒ Optical Backplane
BENEFITS
ƒ Large wire bond contact
pads
ƒ Low contact resistance
ƒ Wire bond or flip chip
applications
ƒ Ground- Signal-Ground pad
configuration for standard
RF test probes
Copyright © 2004
Rev. 1.0, 2004-07-26
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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