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PDF BLM6G22-30 Data sheet ( Hoja de datos )
| Número de pieza | BLM6G22-30 | |
| Descripción | W-CDMA 2100 MHz to 2200 MHz power MMIC | |
| Fabricantes | NXP Semiconductors | |
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BLM6G22-30; BLM6G22-30Gwww.DataSheet4U.com
W-CDMA 2100 MHz to 2200 MHz power MMIC
Rev. 03 — 21 November 2008
Preliminary data sheet
1. Product profile
1.1 General description
30 W LDMOS 2-stage power MMIC for base station applications at frequencies from
2100 MHz to 2200 MHz. Available in gull wing for surface mount (SOT822-1) or flat lead
(SOT834-1).
Table 1. Typical performance
Typical RF performance at Th = 25 °C.
Mode of operation f
(MHz)
2-carrier W-CDMA 2110 to 2170
VDS
(V)
28
PL(AV)
(W)
2
Gp ηD IMD3
(dB) (%) (dBc)
29.5 9
−48[1]
ACPR
(dBc)
−50[1]
[1] Test signal: 3GPP; test model 1; 64 DPCH; PAR = 7 dB at 0.01 % probability on CCDF per carrier; carrier
spacing 10 MHz.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features
I Typical 2-carrier W-CDMA performance at a frequency of 2110 MHz:
N Average output power = 2 W
N Power gain = 30 dB (typ)
N Efficiency = 9 %
N IMD3 = −48 dBc
N ACPR = −50 dBc
I Integrated temperature compensated bias
I Excellent thermal stability
I Biasing of individual stages is externally accessible
I Integrated ESD protection
I Small component size, very suitable for PA size reduction
I On-chip matching (input matched to 50 Ohm, output partially matched)
I High power gain
I Designed for broadband operation (2100 MHz to 2200 MHz)
I Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances
(RoHS)
1 page  
NXP Semiconductors
BLM6G22-30; BLM6G22-30G
www.DataSheet4U.com
W-CDMA 2100 MHz to 2200 MHz power MMIC
8.3 Performance curves
Performance curves are measured in a BLM6G22-30G application circuit.
35
Gp
(dB)
33
31
29
27
001aah622
15
ηD
(%)
13
−45
IMD3,
ACPR
(dBc)
−47
Gp 11
ηD
9
−49
7
IMD3
001aah623
ACPR
25
2050
2100
2150
5
2200
2250
f (MHz)
Fig 3.
Tcase = 25 °C; VDS = 28 V; PL(AV) = 2 W; IDq1 = 270 mA;
IDq2 = 280 mA; carrier spacing = 10 MHz.
2-carrier W-CDMA power gain and drain
efficiency as functions of frequency;
typical values
−51
2050
2100
2150
2200
2250
f (MHz)
Fig 4.
Tcase = 25 °C; VDS = 28 V; PL(AV) = 2 W; IDq1 = 270 mA;
IDq2 = 280 mA; carrier spacing = 10 MHz.
2-carrier W-CDMA adjacent power channel
ratio and third order intermodulation distortion
as functions of frequency; typical values
38
Gp
(dB)
36
34
(1)
Gp
001aah624
35
ηD
(%)
30
25
32 (2)
30
28 (3)
Gp
ηD
Gp
20
15
10
26 (1), (2), (3)
5
24
10−1
1
0
10 102
PL(AV) (W)
VDS = 28 V; IDq1 = 270 mA; IDq2 = 280 mA;
carrier spacing = 10 MHz.
(1) Tcase = −30 °C
(2) Tcase = 25 °C
(3) Tcase = 85 °C
Fig 5.
2-carrier W-CDMA power gain and drain
efficiency as functions of
average output power and temperature;
typical values
IMD3, −20
ACPR
(dBc) −25
−30
001aah625
IMD3
ACPR
−35
−40
−45
(2)
−50
(2)
−55
10−1
(1) (3)
(3) (1)
1
10 102
PL(AV) (W)
VDS = 28 V; IDq1 = 270 mA; IDq2 = 280 mA;
carrier spacing = 10 MHz.
(1) Tcase = −30 °C
(2) Tcase = 25 °C
(3) Tcase = 85 °C
Fig 6.
2-carrier W-CDMA adjacent power channel
ratio and third order intermodulation distortion
as functions of average output power and
temperature; typical values
BLM6G22-30_BLM6G22-30G_3
Preliminary data sheet
Rev. 03 — 21 November 2008
© NXP B.V. 2008. All rights reserved.
5 of 12
5 Page 
NXP Semiconductors
BLM6G22-30; BLM6G22-30G
www.DataSheet4U.com
W-CDMA 2100 MHz to 2200 MHz power MMIC
14. Legal information
14.1 Data sheet status
Document status[1][2]
Product status[3]
Objective [short] data sheet Development
Preliminary [short] data sheet Qualification
Product [short] data sheet
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BLM6G22-30_BLM6G22-30G_3
Preliminary data sheet
Rev. 03 — 21 November 2008
© NXP B.V. 2008. All rights reserved.
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