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PDF 74LVT245B Data sheet ( Hoja de datos )
| Número de pieza | 74LVT245B | |
| Descripción | 3.3V octal transceiver | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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74LVT245B
www.DataSheet4U.com
3.3 V octal transceiver with direction pin (3-state)
Rev. 02 — 8 May 2008
Product data sheet
1. General description
The 74LVT245B is a high-performance BiCMOS product designed for VCC operation at
3.3 V.
This device is an octal transceiver featuring non-inverting 3-state bus compatible outputs
in both send and receive directions. The control function implementation minimizes
external timing requirements. The device features an output enable (OE) input for easy
cascading and a direction (DIR) input for direction control.
2. Features
I 3-state buffers
I Octal bidirectional bus interface
I Input and output interface capability to systems at 5 V supply
I TTL input and output switching levels
I Output capability: +64 mA/−32 mA
I Latch-up protection exceeds 500 mA per JEDEC Std 17
I ESD protection:
N HBM JESD22-A114E exceeds 2000 V
N MM JESD22-A115-A exceeds 200 V
I Bus-hold data inputs eliminate the need for external pull-up resistors for unused inputs
I Live insertion/extraction permitted
I Power-up 3-state
I No bus current loading when output is tied to 5 V bus
3. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name
Description
74LVT245BD −40 °C to +85 °C SO20
plastic small outline package; 20 leads;
body width 7.5 mm
74LVT245BDB −40 °C to +85 °C
SSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
74LVT245BPW −40 °C to +85 °C
TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
74LVT245BBQ −40 °C to +85 °C
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5 × 4.5 × 0.85 mm
Version
SOT163-1
SOT339-1
SOT360-1
SOT764-1
1 page  
NXP Semiconductors
74LVT245B
www.DataSheet4U.com
3.3 V octal transceiver with direction pin (3-state)
8. Recommended operating conditions
Table 5. Recommended operating conditions
Symbol Parameter
Conditions
VCC
VI
IOH
IOL
Tamb
∆t/∆V
supply voltage
input voltage
HIGH-level output current
LOW-level output current
ambient temperature
input transition rise and fall rate
current duty cycle ≤ 50 %; fi ≥ 1 kHz
in free air
output enabled
9. Static characteristics
Min Max Unit
2.7 3.6 V
0 5.5 V
- −32 mA
- 32 mA
- 64 mA
−40 +85 °C
0 10 ns/V
Table 6. Static characteristics
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
−40 °C to +85 °C
Unit
Min Typ[1] Max
VIK
input clamping voltage
VCC = 2.7 V; IIK = −18 mA
−1.2 −0.9 - V
VIH HIGH-level input voltage
VIL LOW-level input voltage
VOH HIGH-level output voltage VCC = 2.7 V to 3.6 V; IOH = −100 µA
VCC = 2.7 V; IOH = −8 mA
VCC = 3.0 V; IOH = −32 mA
VOL LOW-level output voltage VCC = 2.7 V; IOL = 100 µA
2.0 - - V
- - 0.8
VCC − 0.2 VCC − 0.1 - V
2.4 2.5 -
2.0 2.2 - V
0.1 0.2 V
VCC = 2.7 V; IOL = 24 mA
- 0.3 0.5 V
VCC = 3.0 V; IOL = 16 mA
- 0.25 0.4 V
VCC = 3.0 V; IOL = 32 mA
- 0.3 0.5 V
VCC = 3.0 V; IOL = 64 mA
II
input leakage current
control pins
VCC = 0 V or 3.6 V; VI = 5.5 V
VCC = 3.6 V; VI = VCC or GND
I/O data pins
-
-
-
[2]
0.4 0.55 V
1 10 µA
±0.1 ±1 µA
IOFF
ILO
IO(pu/pd)
IBHL
IBHH
IBHLO
power-off leakage current
output leakage current
power-up/power-down
output current
bus hold LOW current
bus hold HIGH current
bus hold LOW
overdrive current
VCC = 3.6 V; VI = 5.5 V
VCC = 3.6 V; VI = VCC
VCC = 3.6 V; VI = 0 V
VCC = 0 V; VI or VO = 0 V to 4.5 V
VO = 5.5 V; VCC = 3.6 V; output HIGH
VCC ≤ 1.2 V VO = 0.5 V to VCC;
VI = GND or VCC; OE = don’t care
VCC = 3.0 V; VI = 0.8 V
VCC = 3.0 V; VI = 2.0 V
VCC = 0 V to 3.0 V; VI = 3.6 V
-
-
−5
-
-
[3] -
[4] 75
−150
500
1 20 µA
0.1 1 µA
−1 - µA
1 ±100 µA
60 125 µA
15 ±100 µA
150 - µA
−75 - µA
- - µA
74LVT245B_2
Product data sheet
Rev. 02 — 8 May 2008
© NXP B.V. 2008. All rights reserved.
5 of 15
5 Page 
NXP Semiconductors
74LVT245B
www.DataSheet4U.com
3.3 V octal transceiver with direction pin (3-state)
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
y
Z
20
D
c
11
EA
X
HE v M A
pin 1 index
1
e
10
wM
bp
A2
A1
Q
(A 3)
A
Lp
L
detail X
θ
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
D (1) E (2) e
6.6
6.4
4.5
4.3
0.65
HE
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT360-1
MO-153
L Lp Q v w y Z (1) θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.5
0.2
8o
0o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 10. Package outline SOT360-1 (TSSOP20)
74LVT245B_2
Product data sheet
Rev. 02 — 8 May 2008
© NXP B.V. 2008. All rights reserved.
11 of 15
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| PDF Descargar | [ Datasheet 74LVT245B.PDF ] | |
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