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PDF NTD5407N Data sheet ( Hoja de datos )
| Número de pieza | NTD5407N | |
| Descripción | Power MOSFET ( Transistor ) | |
| Fabricantes | ON Semiconductor | |
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NTD5407N
www.DataSheet4U.com
Power MOSFET
40 V, 38 A, Single N−Channel, DPAK
Features
• Low RDS(on)
• High Current Capability
• Low Gate Charge
• These are Pb−Free Devices
Applications
• Electronic Brake Systems
• Electronic Power Steering
• Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Units
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current − RqJC (Note 1)
Steady
State
TC = 25°C
TC = 100°C
Power Dissipation −
RqJC (Note 1)
Steady
State
TC = 25°C
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
VDSS
VGS
ID
PD
IDM
TJ,
TSTG
40
±20
38
27
75
75
−55 to
175
V
V
A
W
A
°C
Source Current (Body Diode)
Single Pulse Drain−to Source Avalanche
Energy − (VDD = 50 V, VGS = 10 V, IPK = 17 A,
L = 1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IS
EAS
TL
36 A
150 mJ
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Max Units
Junction−to−Case (Drain)
RθJC
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2.0 °C/W
http://onsemi.com
V(BR)DSS
40 V
RDS(ON) TYP
21 mΩ @ 10 V
ID MAX
(Note 1)
38 A
N−Channel
D
G
S
4
12
3
DPAK
CASE 369C
STYLE 2
MARKING
DIAGRAM
1
YWW
54
07NG
Y
WW
5407N
G
= Year
= Work Week
= Specific Device Code
= Pb−Free Device
ORDERING INFORMATION
Device
Package
Shipping†
NTD5407NG
DPAK
(Pb−Free)
75 Units / Rail
NTD5407NT4G DPAK 2500 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
October, 2005 − Rev. 0
1
Publication Order Number:
NTD5407N/D
1 page  
NTD5407N
PACKAGE DIMENSIONS
www.DataSheet4U.com
DPAK
CASE 369C−01
ISSUE O
B
VR
−T−
SEATING
PLANE
C
E
S
F
4
1 23
A
K
J
LH
D 2 PL
G 0.13 (0.005) M T
U
Z
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.101
3.0
0.118
5.80
0.228
1.6
0.063
6.172
0.243
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
INCHES
DIM MIN MAX
A 0.235 0.245
B 0.250 0.265
C 0.086 0.094
D 0.027 0.035
E 0.018 0.023
F 0.037 0.045
G 0.180 BSC
H 0.034 0.040
J 0.018 0.023
K 0.102 0.114
L 0.090 BSC
R 0.180 0.215
S 0.025 0.040
U 0.020 −−−
V 0.035 0.050
Z 0.155 −−−
MILLIMETERS
MIN MAX
5.97 6.22
6.35 6.73
2.19 2.38
0.69 0.88
0.46 0.58
0.94 1.14
4.58 BSC
0.87 1.01
0.46 0.58
2.60 2.89
2.29 BSC
4.57 5.45
0.63 1.01
0.51 −−−
0.89 1.27
3.93 −−−
STYLE 2:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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| PDF Descargar | [ Datasheet NTD5407N.PDF ] | |
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