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PDF TGA2923-SG Data sheet ( Hoja de datos )
| Número de pieza | TGA2923-SG | |
| Descripción | 10 Watt MMDS Packaged Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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Advance Product Information
wwAwu.Dgata1S6h,ee2t04U0.c5om
10 Watt MMDS Packaged Amplifier
TGA2923-SG
Key Features
• 3.5 GHz Application Frequency Range
• 9 dB Nominal Gain
• 10 Watt Nominal Psat
• 2.5% EVM at 30 dBm output power
• IMD3 -45 dBc @ 28 dBm SCL, Typical
• Bias Conditions: 8 V @ 1.2 A (Quiescent)
• 0.5 µm HFET Technology
• 2 lead Cu-alloy base and internally partially
matched package
Primary Applications
• 802.16 Broadband Wireless
• WiMAX
Product Description
The TGA2923-SG HPA provides 9
dB of gain, 10 W of output power at
3.5 GHz and 2.5% EVM at 30 dBm
output power for OFDM 64 QMA.
The device is ideally suited for high
linearity, high power wireless data
applications such as 802.16 and
WiMAX. The package has a high
thermal conductivity copper alloy
base. Internal partial matching
simplifies system board layout by
requiring a minimum of external
components.The device can be
tuned to 3.3 - 3.8GHz range in 200
MHz bandwidth. 2 object
components (C4 & C5) can be
tuned for bandwidth.
Lead-Free & RoHS compliant.
Evaluation Boards are available.
Fixtured Measured Performance
Bias Conditions: Vd = 8 V, Idq =1.2 A
Performance data taken in a 3.5 GHz application circuit
15
10
5
0
-5
-10
-15
-20
-25
3
S21
S11
S22
3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9
Frequency (GHZ)
4
40
39.5 P2dB
39
38.5 P1dB
38
37.5
37
3.3
3.4 3.5 3.6 3.7
Frequency (GHz)
3.8
Note: This device is early in the characterization process prior to finalizing all electrical specifications. Specifications are subject to
change without notice.
1
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
1 page  
Advance Product Information
wwAwu.Dgata1S6h,ee2t04U0.c5om
TGA2923-SG
Measured Fixtured Data
Application Circuit tuned to 3.5 GHz
Bias Conditions: Vd = 8 V, Idq = 1.2 A
50
45 3.5GHz
40 3.55GHz
35 3.6GHz
30
3.65GHz
25
20 3.7GHz
15
10
5
0
18 20 22 24 26 28 30 32 34 36
Pin (dBm)
2500
2300
2100
1900
1700
1500
3.5GHz
3.55GHz
3.6GHz
3.65GHz
3.7GHz
1300
1100
18 20 22 24 26 28 30 32 34 36
Pin (dBm)
5
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
5 Page 
Advance Product Information
wwAwu.Dgata1S6h,ee2t04U0.c5om
TGA2923-SG
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
Ramp-up Rate
Activation Time and
Temperature
Time above Melting Point
Max Peak Temperature
Time within 5 °C of Peak
Temperature
Ramp-down Rate
SnPb
3 °C/sec
60 – 120 sec @ 140 – 160 °C
60 – 150 sec
240 °C
10 – 20 sec
4 – 6 °C/sec
Pb Free
3 °C/sec
60 – 180 sec @ 150 – 200 °C
60 – 150 sec
260 °C
10 – 20 sec
4 – 6 °C/sec
Ordering Information
Part
TGA2923-SG
Package Style
Gull Wing Leads
11
TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: [email protected] Web: www.triquint.com
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet TGA2923-SG.PDF ] | |
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