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Número de pieza | NTA7002N | |
Descripción | Small Signal MOSFET | |
Fabricantes | ON Semiconductor | |
Logotipo | ||
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Small Signal MOSFET
30 V, 154 mA, Single, N−Channel, Gate
ESD Protection, SC−75
Features
• Low Gate Charge for Fast Switching
• Small 1.6 x 1.6 mm Footprint
• ESD Protected Gate
• Pb−Free Package is Available
Applications
• Power Management Load Switch
• Level Shift
• Portable Applications such as Cell Phones, Media Players,
Digital Cameras, PDA’s, Video Games, Hand−Held Computers, etc.
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Steady State = 25°C
VDSS
VGS
ID
30
"10
154
V
V
mA
Power Dissipation
(Note 1)
Steady State = 25°C PD
300 mW
Pulsed Drain Current
tP v 10 ms
Operating Junction and Storage Temperature
Continuous Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IDM
TJ,
TSTG
ISD
TL
618
−55 to
150
154
260
mA
°C
mA
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1)
RqJA
416 °C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
http://onsemi.com
V(BR)DSS
30 V
RDS(on)
Typ @ VGS
1.4 W @ 4.5 V
2.3 W @ 2.5 V
ID MAX
(Note 1)
154 mA
3
1
2
N−Channel
PIN CONNECTIONS
SC−75 (3−Leads)
Gate 1
3 Drain
Source 2
(Top View)
3 MARKING DIAGRAM
3
2
1
SC−75 / SOT−416
CASE 463
STYLE 5
T6 MG
G
12
T6 = Specific Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
NTA7002NT1 SC−75 3000 Tape & Reel
NTA7002NT1G
SC−75
(Pb−Free)
3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 1
1
Publication Order Number:
NTA7002N/D
1 page NTA7002N
PACKAGE DIMENSIONS
www.DataSheet4U.com
b 3 PL
0.20 (0.008) M D
−E−
2
3
1
C
L
SC−75 / SOT−416
CASE 463−01
ISSUE F
e −D−
HE 0.20 (0.008) E
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 0.70 0.80 0.90 0.027 0.031 0.035
A1 0.00 0.05 0.10 0.000 0.002 0.004
b 0.15 0.20 0.30 0.006 0.008 0.012
C 0.10 0.15 0.25 0.004 0.006 0.010
D 1.55 1.60 1.65 0.059 0.063 0.067
E 0.70 0.80 0.90 0.027 0.031 0.035
e 1.00 BSC
0.04 BSC
L 0.10 0.15 0.20 0.004 0.006 0.008
HE 1.50 1.60 1.70 0.061 0.063 0.065
STYLE 5:
PIN 1. GATE
2. SOURCE
3. DRAIN
SOLDERING FOOTPRINT*
0.356
0.014
1.803
0.071
0.787
0.031
0.508
0.020
1.000
0.039
SCALE 10:1
ǒ mm Ǔ
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
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Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet NTA7002N.PDF ] |
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