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PDF LX7206 Data sheet ( Hoja de datos )

Número de pieza LX7206
Descripción Integrated EMI Filter and ESD Protection
Fabricantes Microsemi Corporation 
Logotipo Microsemi Corporation Logotipo



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No Preview Available ! LX7206 Hoja de datos, Descripción, Manual

LX7206
www.DataSheet4U.com
® Integrated EMI Filter & ESD Protection for
TM
Earpiece Speaker & Microphone Ports
PRODUCTION DATA SHEET
DESCRIPTION
Proliferation of digital portable LX7206 is an integrated low pass
electronic equipment has created a filter with ESD protection that filters
noisy environment in which all out the undesired frequencies as well as
devices become susceptible to protecting the port against both positive
Electromagnetic Interference (EMI). and negative ESD voltages. The device
Interference form cell phone is a 3x2 array flip chip and measures
frequencies of 800-900 MHz and 1.5 x 1.0 x 0.65 mm. The small size
1.9GHz as well as the growing and profile of this device is ideally
wireless LAN frequencies of 2.4- suited for portable applications. The
6GHz can couple into the audio port absence of leadframe and bondwires
of a handheld device and adversely minimizes inductance and optimizes the
affect its performance. FCC Part 15 high frequency filter performance.
sets maximum allowable emission and LX7206 exceeds the requirements of
immunity levels for all digital devices. IEC61000-4-2 (15KV air discharge and
8KV contact discharge).
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
BENEFITS
ƒ Filter response characterized up to 6 GHz
ƒ Low insertion loss in the pass band
ƒ >20dB attenuation in the 800-900 MHz range
ƒ >15dB attenuation in the WLAN frequencies of 2.4GHz and 5.0-6.0 GHz
KEY FEATURES
ƒ Flip Chip construction
ƒ Bi-directional EMI/RFI low-pass
filter
ƒ ESD protection with integrated
line termination resistor
ƒ Bi-directional TVS protects
against negative ESD voltages
in audio applications
ƒ Low TVS operating voltage
(5.0V)
ƒ Low leakage current
ƒ 0.5mm Pitch Chip Scale
Package designed for direct
assembly on FR4 PCB using
conventional assembly
techniques
APPLICATIONS
ƒ Cell phones and Accessories
ƒ Personal Digital Assistants
(PDA’s)
ƒ Pagers
ƒ MP3 Players
ƒ Desktops and Notebook
Computers
ƒ Digital Camcorders
A1
Earpiece
Input
Device Schematic
10
CC
PRODUCT HIGHLIGHT
B1
Earpiece
Output
B
A3
Microphone
Input
GND A2, B2
68
B3
A
CC
Microphone
Output
12 3
GND A2, B2
Copyright © 2004
Rev. 1.0, 2004-10-05
PACKAGE ORDER INFO
TJ (°C)
0.5mm Pitch
SP Chip Scale Package (CSP)
-40 to 125
LX7206ISP
Note: Available in Tape & Reel. Append the letters “TR” to the part
number. (i.e. LX7206ISP-TR)
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1

1 page




LX7206 pdf
LX7206
www.DataSheet4U.com
® Integrated EMI Filter & ESD Protection for
TM
Earpiece Speaker & Microphone Ports
PRODUCTION DATA SHEET
PACKAGE DIMENSIONS
SP 0.5mm Chip Scale Package
1.5mm
0.25mm dia. 63/37 Sn/Pb
Eutectic Solder Bumps
0.5mm
B
A
1
0.5mm 1.0 mm
23
SP Package – Bumps Up
Pin A1 Identification Mark
06
YWWA
Y = Year | WW = Work Week | A = Lot Code
SP Package – Bump Side Down
Device Orientation in Tape
Copyright © 2004
Rev. 1.0, 2004-10-05
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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