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PDF UCLAMP0508T Data sheet ( Hoja de datos )
| Número de pieza | UCLAMP0508T | |
| Descripción | 8-Line ESD protection | |
| Fabricantes | Semtech Corporation | |
| Logotipo |  |
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PROTECTION PRODUCTS - MicroClampTM
Description
The μClampTM series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. It is designed to replace multilayer varistors
(MLVs) in portable applications such as cell phones, note-
book computers, and other portable electronics. It fea-
tures large cross-sectional area junctions for conducting
high transient currents. TVS diodes offer desirable char-
acteristics for board level protection including fast re-
sponse time, low operating and clamping voltage, and
no device degradation.
The μClampTM0508T is in a 8-pin, RoHS/WEEE compli-
ant, SLP1713P8T package. It measures 1.7 x 1.3 mm
with a nominal height of only 0.4mm. The leads are
spaced at a pitch of 0.4mm and are finished with lead-
free NiPdAu. Each device features eight TVS diodes
with an operating voltage of 5 volts and a maximum
loading capacitance of only 10pF.
They may be used to meet the ESD immunity require-
ments of IEC 61000-4-2, Level 4 (±15kV air, ±8kV
contact discharge). The combination of small size and
high ESD surge capability makes them ideal for use in
portable applications such as cellular phones, digital
cameras, and notebook computers.
uClamp0508T
Low Profile μClampTM
8-Line EwSwDwp.roD taect taioSnh e e t
Features
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package
Protects eight data lines
Low clamping voltage
Working voltage: 5V
Low capacitance (10pF)
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP1713P8T package
RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.3 x 0.4 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code
Packaging : Tape and Reel
Applications
Cellular Handsets & Accessories
Notebooks & Handhelds
Micro SD Ports
MMC & HS-MMC Ports
Portable Instrumentation
Digital Cameras
Peripherals
Dimensions
Schematic
1.70
123 4
1.30
1
23
45
67
8
8 7 6 05.40 BSC
0.40
Nominal Dimensions (mm)
(SLP1713P8T Bottom View)
Revision 01/07/2008
1
Tab
www.semtech.com
1 page  
uClamp0508T
PROTECTION PRODUCTS
Applications Information
Device Connection Options
This device is designed to protect eight data lines. The
device is unidirectional and may be used on lines
where the signal polarity is above ground.
Ground Connection Recommendation
Parasitic inductance present in the board layout will
affect the filtering and ESD performance of the device.
Ground loop inductance can be reduced by using
multiple vias to make the connection to the ground
plane. Figure 2 shows the recommended device
layout. The ground pad vias have a diameter of 0.008
inches (0.20 mm) while the two external vias have a
diameter of 0.010 inches (0.250mm). The internal
vias are spacedapproximately evenly from the center
of the pad. The designer may choose to use more vias
with a smaller diameter (such as 0.005 inches or
0.125mm) since changing the diameter of the via will
result in little change in inductance.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
z Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
z Minimize the path length between the TVS and the
protected line.
z Minimize all conductive loops including power and
ground loops.
z The ESD transient return path to ground should be
kept as short as possible.
z Never run critical signals near board edges.
z Use ground planes whenever possible.
www.DataSheet4U.com
Figure 1 - Circuit Diagram (Eight Each)
Figure 2 - Recommended Layout using Ground Vias
© 2008 Semtech Corp.
5
www.semtech.com
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet UCLAMP0508T.PDF ] | |
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