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PDF EBE51ED8AGWA Data sheet ( Hoja de datos )
| Número de pieza | EBE51ED8AGWA | |
| Descripción | 512MB Unbuffered DDR2 SDRAM DIMM | |
| Fabricantes | Elpida Memory | |
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PRELIMINARY DATA SHEET
www.DataSheet4U.com
512MB Unbuffered DDR2 SDRAM DIMM
EBE51ED8AGWA (64M words × 72 bits, 1 Rank)
Specifications
• Density: 512MB
• Organization
64M words × 72 bits, 1 rank
• Mounting 9 pieces of 512M bits DDR2 SDRAM
sealed in FBGA
• Package: 240-pin socket type dual in line memory
module (DIMM)
PCB height: 30.0mm
Lead pitch: 1.0mm
Lead-free (RoHS compliant)
• Power supply: VDD = 1.8V ± 0.1V
• Data rate: 667Mbps/533Mbps (max.)
• Four internal banks for concurrent operation
(components)
• Interface: SSTL_18
• Burst lengths (BL): 4, 8
• /CAS Latency (CL): 3, 4, 5
• Precharge: auto precharge option for each burst
access
• Refresh: auto-refresh, self-refresh
• Refresh cycles: 8192 cycles/64ms
Average refresh period
7.8µs at 0°C ≤ TC ≤ +85°C
3.9µs at +85°C < TC ≤ +95°C
• Operating case temperature range
TC = 0°C to +95°C
Features
• Double-data-rate architecture; two data transfers per
clock cycle
• The high-speed data transfer is realized by the 4 bits
prefetch pipelined architecture
• Bi-directional differential data strobe (DQS and /DQS)
is transmitted/received with data for capturing data at
the receiver
• DQS is edge-aligned with data for READs; center-
aligned with data for WRITEs
• Differential clock inputs (CK and /CK)
• DLL aligns DQ and DQS transitions with CK
transitions
• Commands entered on each positive CK edge; data
and data mask referenced to both edges of DQS
• Data mask (DM) for write data
• Posted /CAS by programmable additive latency for
better command and data bus efficiency
• Off-Chip-Driver Impedance Adjustment and On-Die-
Termination for better signal quality
• /DQS can be disabled for single-ended Data Strobe
operation
Document No. E0922E10 (Ver. 1.0)
Date Published June 2006 (K) Japan
Printed in Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2006
1 page  
EBE51ED8AGWA
Serial PD Matrix
www.DataSheet4U.com
Byte No.
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 Hex value
Number of bytes utilized by module
manufacturer
1
0
0
0
0
0
0
0
80H
Total number of bytes in serial PD
device
0 0 0 0 1 0 0 0 08H
Memory type
0 0 0 0 1 0 0 0 08H
Number of row address
0 0 0 0 1 1 1 0 0EH
Number of column address
0 0 0 0 1 0 1 0 0AH
Number of DIMM ranks
0 1 1 0 0 0 0 0 60H
Module data width
0 1 0 0 1 0 0 0 48H
Module data width continuation
0 0 0 0 0 0 0 0 00H
Voltage interface level of this assembly 0 0 0 0 0 1 0 1 05H
DDR SDRAM cycle time, CL = 5
-6E
0 0 1 1 0 0 0 0 30H
-5C 0 0 1 1 1 1 0 1 3DH
SDRAM access from clock (tAC)
-6E
0 1 0 0 0 1 0 1 45H
-5C 0 1 0 1 0 0 0 0 50H
DIMM configuration type
0 0 0 0 0 0 1 0 02H
Refresh rate/type
1 0 0 0 0 0 1 0 82H
Primary SDRAM width
0 0 0 0 1 0 0 0 08H
Error checking SDRAM width
0 0 0 0 1 0 0 0 08H
Reserved
0 0 0 0 0 0 0 0 00H
SDRAM device attributes:
Burst length supported
0 0 0 0 1 1 0 0 0CH
SDRAM device attributes: Number of
banks on SDRAM device
0
0
0
0
0
1
0
0
04H
SDRAM device attributes:
/CAS latency
0 0 1 1 1 0 0 0 38H
DIMM Mechanical Characteristics
0 0 0 0 0 0 0 1 01H
DIMM type information
0 0 0 0 0 0 1 0 02H
SDRAM module attributes
0 0 0 0 0 0 0 0 00H
SDRAM device attributes: General 0 0 0 0 0 0 1 1 03H
Minimum clock cycle time at CL = 4
-6E, -5C
0
0
1
1
1
1
0
1
3DH
Maximum data access time (tAC) from
clock at CL = 4
0 1 0 1 0 0 0 0 50H
-6E, -5C
Minimum clock cycle time at CL = 3 0 1 0 1 0 0 0 0 50H
Maximum data access time (tAC) from
clock at CL = 3
0
1
1
0
0
0
0
0
60H
Minimum row precharge time (tRP) 0 0 1 1 1 1 0 0 3CH
Comments
128 bytes
256 bytes
DDR2 SDRAM
14
10
1
72
0
SSTL 1.8V
3.0ns*1
3.75ns*1
0.45ns*1
0.5ns*1
ECC
7.8µs
×8
×8
0
4,8
4
3, 4, 5
4.00mm max.
Unbuffered
Normal
Weak Driver
50Ω ODTSupport
3.75ns*1
0.5ns*1
5.0ns*1
0.6ns*1
15ns
Preliminary Data Sheet E0922E10 (Ver. 1.0)
5
5 Page 
EBE51ED8AGWA
DC Characteristics 1 (TC = 0°C to +85°C, VDD = 1.8V ± 0.1V, VSS = 0V)
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Parameter
Operating current
(ACT-PRE)
Symbol Grade
IDD0
-6E
-5C
Operating current
(ACT-READ-PRE)
IDD1
-6E
-5C
Precharge power-down
standby current
IDD2P
-6E
-5C
Precharge quiet standby
current
IDD2Q
-6E
-5C
Idle standby current
IDD2N
-6E
-5C
Active power-down
standby current
IDD3P-F
-6E
-5C
IDD3P-S
-6E
-5C
Active standby current IDD3N
-6E
-5C
Operating current
IDD4R
(Burst read operating)
-6E
-5C
Operating current
IDD4W
(Burst write operating)
-6E
-5C
Auto-refresh current IDD5
-6E
-5C
max.
1035
990
1170
1125
90
90
225
225
315
270
360
360
225
225
630
585
2070
1710
1980
1710
2430
2250
Unit Test condition
one bank; tCK = tCK (IDD), tRC = tRC (IDD),
tRAS = tRAS min.(IDD);
mA CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
one bank; IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = 0;
tCK = tCK (IDD), tRC = tRC (IDD),
mA tRAS = tRAS min.(IDD); tRCD = tRCD (IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data pattern is same as IDD4W
all banks idle;
tCK = tCK (IDD);
mA CKE is L;
Other control and address bus inputs are STABLE;
Data bus inputs are FLOATING
all banks idle;
tCK = tCK (IDD);
mA CKE is H, /CS is H;
Other control and address bus inputs are STABLE;
Data bus inputs are FLOATING
all banks idle;
tCK = tCK (IDD);
mA CKE is H, /CS is H;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
all banks open;
mA tCK = tCK (IDD);
CKE is L;
Fast PDN Exit
MRS(12) = 0
Other control and address bus
mA
inputs are STABLE;
Slow PDN Exit
Data bus inputs are FLOATING MRS(12) = 1
all banks open;
tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD);
mA CKE is H, /CS is H between valid commands;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
all banks open, continuous burst reads, IOUT = 0mA;
BL = 4, CL = CL(IDD), AL = 0;
mA
tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data pattern is same as IDD4W
all banks open, continuous burst writes;
BL = 4, CL = CL(IDD), AL = 0;
mA
tCK = tCK (IDD), tRAS = tRAS max.(IDD), tRP = tRP (IDD);
CKE is H, /CS is H between valid commands;
Address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
tCK = tCK (IDD);
Refresh command at every tRFC (IDD) interval;
mA CKE is H, /CS is H between valid commands;
Other control and address bus inputs are SWITCHING;
Data bus inputs are SWITCHING
Preliminary Data Sheet E0922E10 (Ver. 1.0)
11
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