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PDF ACT108-600E Data sheet ( Hoja de datos )
| Número de pieza | ACT108-600E | |
| Descripción | AC Thyristor power switch | |
| Fabricantes | NXP Semiconductors | |
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ACT108-600E
AC Thyristor power switch
Rev. 02 — 21 October 2009
www.DataSheet4U.com
Product data sheet
1. Product profile
1.1 General description
AC Thyristor power switch in a SOT54 plastic package with self-protective capabilities
against low and high energy transients
1.2 Features and benefits
Exclusive negative gate triggering
Full cycle AC conduction
Remote gate separates the gate driver
from the effects of the load current
Safe clamping of low energy
over-voltage transients
Self-protective turn-on during high
energy voltage transients
Very high noise immunity
1.3 Applications
Fan motor circuits
Lower-power highly inductive, resistive
and safety loads
Pump motor circuits
1.4 Quick reference data
Table 1. Quick reference
Symbol Parameter
VDRM
repetitive peak
off-state voltage
IGT gate trigger current
IT(RMS)
dVD/dt
RMS on-state
current
rate of rise of
off-state voltage
VCL clamping voltage
VPP peak pulse voltage
VT on-state voltage
Conditions
VD = 12 V; IT = 100 mA;
LD+G-; Tj = 25 °C;
see Figure 6
VD = 12 V; IT = 100 mA;
LD- G-; Tj = 25 °C
full sine wave; Tlead ≤ 71 °C;
see Figure 1
VDM = 402 V; Tj = 125 °C;
gate open circuit;
see Figure 10
ICL = 100 mA; tp = 1 ms;
Tj ≤ 125 °C; see Figure 13
Tj = 25 °C; non-repetitive,
off-state; see Figure 4
IT = 1.1 A; see Figure 9
Min Typ Max Unit
- - 600 V
1-
10 mA
1-
--
1000 -
10 mA
0.8 A
- V/µs
650 -
--
--
-V
2 kV
1.3 V
1 page  
NXP Semiconductors
5. Thermal characteristics
Table 5.
Symbol
Rth(j-lead)
Rth(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from full cycle with heatsink compound;
junction to lead
see Figure 5
thermal resistance from full cycle; printed-circuit board mounted;
junction to ambient
lead length 4 mm
102
Zth(j-lead)
(K/W)
10
ACT108-600E
AC Thwywriws.tDoartapSohweeetr4Us.wcoitmch
Min Typ Max Unit
- - 60 K/W
- 150 - K/W
003aad294
1
10−1
P
10−2
10−5
10−4
10−3
10−2
10−1
tp t
1 tp (s)
10
Fig 5. Transient thermal impedance from junction to lead as a function of pulse width
ACT108-600E_2
Product data sheet
Rev. 02 — 21 October 2009
© NXP B.V. 2009. All rights reserved.
5 of 12
5 Page 
NXP Semiconductors
ACT108-600E
AC Thwywriws.tDoartapSohweeetr4Us.wcoitmch
9. Legal information
9.1 Data sheet status
Document status [1][2]
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
Product status[3]
Development
Qualification
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
9.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
ACT108-600E_2
Product data sheet
Rev. 02 — 21 October 2009
© NXP B.V. 2009. All rights reserved.
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