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Número de pieza FAG50
Descripción IRFAG50
Fabricantes International Rectifier 
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No Preview Available ! FAG50 Hoja de datos, Descripción, Manual

PD - 90582
REPETITIVE AVALANCHE AND dv/dt RATED
HEXFETTRANSISTORS
THRU-HOLE (TO-204AA/AE)
IRFAG50
1000V, N-CHANNEL
Product Summary
Part Number BVDSS
IRFAG50
1000V
RDS(on)
2.0
ID
5.6Α
The HEXFETtechnology is the key to International
Rectifier’s advanced line of power MOSFET transistors.
The efficient geometry and unique processing of this latest
“State of the Art” design achieves: very low on-state resis-
tance combined with high transconductance; superior re-
verse energy and diode recovery dv/dt capability.
The HEXFET transistors also feature all of the well estab-
lished advantages of MOSFETs such as voltage control,
very fast switching, ease of paralleling and temperature
stability of the electrical parameters.
They are well suited for applications such as switching
power supplies, motor controls, inverters, choppers, audio
amplifiers and high energy pulse circuits.
TO-3
Features:
n Repetitive Avalanche Ratings
n Dynamic dv/dt Rating
n Hermetically Sealed
n Simple Drive Requirements
n Ease of Paralleling
Absolute Maximum Ratings
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Parameter
ID @ VGS = 0V, TC = 25°C Continuous Drain Current
ID @ VGS = 0V, TC = 100°C
IDM
Continuous Drain Current
Pulsed Drain Current
PD @ TC = 25°C
Max. Power Dissipation
Linear Derating Factor
VGS
EAS
IAR
EAR
dv/dt
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
TJ Operating Junction
TSTG
Storage Temperature Range
Lead Temperature
Weight
Units
5.6
3.5 A
22
150 W
1.2 W/°C
±20 V
860 mJ
5.6 A
15 mJ
1.0 V/ns
-55 to 150
oC
300 (0.063 in. (1.6mm) from case for 10s)
11.5(typical)
g
For footnotes refer to the last page
www.irf.com
1
01/24//01

1 page




FAG50 pdf
Fig 9. Maximum Drain Current Vs.
Case Temperature
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IRFAG50
VDS
VGS
RG
RD
D.U.T.
10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
+-V D D
Fig 10a. Switching Time Test Circuit
VDS
90%
10%
VGS
td(on) tr
td(off) tf
Fig 10b. Switching Time Waveforms
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
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