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WCMC2016V1X fiches techniques PDF

Weida Semiconductor - 128K x 16 Pseudo Static RAM DIE

Numéro de référence WCMC2016V1X
Description 128K x 16 Pseudo Static RAM DIE
Fabricant Weida Semiconductor 
Logo Weida Semiconductor 





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WCMC2016V1X fiche technique
ADVANCE INFORMATION
WCMC2016V1X
General Physical Specification
128K x 16 Pseudo Static RAM DIE
For product parameters and availability, please refer to the WCMC2016V1X product datasheet available on the Cypress
Semiconductor Website (http://www.cypress.com).
Mfg Part Number: GC2016V5A
Die Part Number:
Die Technology: PowerChip 0.165 µm
Metal I: 420 nm TiN/AlCu
Metal II: 880 nm TiN/Ti/AlCu/TiN
Metal III: None
Die Passivation: 780nm P-Si3N4 + Polyimide
Substrate Connection Req.:
Wafer Diameter [mm]:
Die Size [µm]:
Step Size [µm]:
Scribe Size [µm]:
Pad Count:
Pad Size [µm]:
Ground
200.00
4010.74 x 1565.84
4095.44 x 1650.89
84.70 x 84.94
64
73.6 x 73.6
Product Thickness Guide
Code
XW
XW14
XW11
Description
Die (25-30 mil) in wafer form.
Die (14 mil) in wafer form.
Die (11 mil) in wafer form.
Min
Nom
Max
Unit
617 685 754 µm
320 355 391 µm
252 280 308 µm
www.DataSheet4U.com
Weida Semiconductor, Inc.
38-xyxyx
Revised August 22, 2001

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