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PDF IP5311CX5 Data sheet ( Hoja de datos )

Número de pieza IP5311CX5
Descripción Dual-channel Integrated Passive Filter Network
Fabricantes NXP Semiconductors 
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No Preview Available ! IP5311CX5 Hoja de datos, Descripción, Manual

IP5311CX5
Dual-channel integrated passive filter network with ESD
protection to IEC 61000-4-2 level 4
Rev. 01 — 30 November 2009
Product data sheet
1. Product profile
1.1 General description
IP5311CX5 is a dual-channel RC low-pass filter array which is designed to provide filtering
of undesired RF signals in the 10 MHz to 6000 MHz frequency band. In addition,
IP5311CX5 incorporates diodes to provide protection to downstream components from
ElectroStatic Discharge (ESD) voltages as high as ±15 kV contact according the
IEC 61000-4-2 model, far exceeding standard level 4.
The device is optimized for loudspeaker applications using speakers of 10 Ω to 32+ Ω
impedance.
IP5311CX5 is fabricated using monolithic silicon technology and integrates several
resistors, bidirectional diodes and two high density capacitors in a single Wafer-Level
Chip-Scale Package (WLCSP). These features make the IP5311CX5 ideal for use in
applications requiring the utmost in miniaturization such as mobile phone handsets,
cordless telephones and personal digital devices.
1.2 Features
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„ Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)
„ Dual-channel integrated RC filter network with high density capacitors (2 × 5 nF)
„ Integrated ESD protection withstanding ±15 kV contact discharge, far exceeding
IEC 61000-4-2 level 4
„ WLCSP with 0.4 mm pitch
1.3 Applications
„ Cellular and Personal Communication System (PCS) mobile handsets
„ Cordless telephones
„ Wireless data (WAN/LAN) systems

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IP5311CX5 pdf
NXP Semiconductors
IP5311CX5
Dual-channel integrated passive filter network
7. Application information
7.1 Insertion loss
The insertion loss measurement configuration of a typical 50 Ω NetWork Analyzer (NWA)
system for evaluation of the IP5311CX5 is shown in Figure 3.
The insertion loss of both channels at frequencies up to 6 GHz is displayed in Figure 4.
IN
50 Ω
DUT
TEST BOARD
OUT
50 Ω
Vgen
001aai755
Fig 3. Frequency response measurement configuration
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0
s21
(dB)
10
20
(1)
(2)
001aak630
30
40
50
101
1
10 102
(1) Channel 1 (pins A1 and A2).
(2) Channel 2 (pins C1 and C2).
Fig 4. Measured insertion loss magnitudes
103 104
f (MHz)
IP5311CX5_1
Product data sheet
Rev. 01 — 30 November 2009
© NXP B.V. 2009. All rights reserved.
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IP5311CX5 arduino
NXP Semiconductors
IP5311CX5
Dual-channel integrated passive filter network
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
9.3.4 Cleaning
Cleaning can be done after reflow soldering.
10. Abbreviations
Table 6. Abbreviations
Acronym
Description
DUT
Device Under Test
ESD
ElectroStatic Discharge
LAN Local Area Network
NWA
NetWork Analyzer
PCS
Personal Communication System
RoHS
Restriction of Hazardous Substances
WAN
Wide Area Network
WLCSP
Wafer-Level Chip-Scale Package
www.D1a1ta.ShReete4Uv.ciosmion history
Table 7. Revision history
Document ID
Release date
IP5311CX5_1
20091130
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
IP5311CX5_1
Product data sheet
Rev. 01 — 30 November 2009
© NXP B.V. 2009. All rights reserved.
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