PDF NBXSPA008 Data sheet ( Hoja de datos )

Número de pieza	NBXSPA008
Descripción	LVDS Clock Oscillator
Fabricantes	ON Semiconductor
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No Preview Available ! NBXSPA008 2.5 V / 3.3 V, 161.1328 MHz LVDS Clock Oscillator The NBXSPA008 single frequency crystal oscillator (XO) is designed to meet today’s requirements for 2.5 V and 3.3 V LVDS clock generation applications. The device uses a high Q fundamental crystal and Phase Lock Loop (PLL) multiplier to provide 161.1328 MHz, ultra low jitter and phase noise LVDS differential output. This device is a member of ON Semiconductor’s PureEdget clock family that provides accurate and precision clock solutions. Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape and reel in quantities of 1000. Features • LVDS Differential Output • Uses High Q Fundamental Mode Crystal and PLL Multiplier • Ultra Low Jitter and Phase Noise − 0.5 ps (12 kHz − 20 MHz) • Output Frequency − 161.1328 MHz • Hermetically Sealed Ceramic SMD Package • RoHS Compliant • Operating Range: 2.5 V ±5% Operating Range: 3.3 V ±10% • Total Frequency Stability − $50 ppm • This is a Pb−Free Device Applications • Ethernet, Gigabit Ethernet • WAN • Networking www.DataSheet4U.com VDD 6 CLK CLK 54 http://onsemi.com MARKING DIAGRAM 6 PIN CLCC LN SUFFIX CASE 848AB NBXSPA008 161.1328 AWLYYWW NBXSPA008 161.1328 A WL YY WW G or G = NBXSPA008 (±50 PPM) = Output Frequency (MHz) = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package ORDERING INFORMATION Device Package Shipping† NBXSPA008LN1TAG CLCC−6 1000/ (Pb−Free) Tape & Reel NBXSPA008LNHTAG CLCC−6 100/ (Pb−Free) Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Crystal PLL Clock Multiplier 1 23 OE NC GND Figure 1. Simplified Logic Diagram © Semiconductor Components Industries, LLC, 2009 August, 2009 − Rev. 0 1 Publication Order Number: NBXSPA008/D 1 page NBXSPA008 Table 7. RELIABILITY COMPLIANCE Parameter ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁShock ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁSolderability ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁVibration ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁSolvent Resistance ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁResistance to Soldering Heat ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁThermal Shock ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁMoisture Resistance Standard Mechanical Mechanical Mechanical Mechanical Mechanical Environment Environment Method MIL−STD−833, Method 2002, Condition B MIL−STD−833, Method 2003 MIL−STD−833, Method 2007, Condition A MIL−STD−202, Method 215 MIL−STD−203, Method 210, Condition I or J MIL−STD−833, Method 1001, Condition A MIL−STD−833, Method 1004 NBXSPA008 Driver Device CLK CLK Zo = 50 W Zo = 50 W 100 W D Receiver Device D Figure 4. Typical Termination for Output Driver and Device Evaluation www.DataSheet4U.com Temperature (°C) 260 217 temp. 260°C 20 − 40 sec. max. peak 3°C/sec. max. 6°C/sec. max. ramp−up 175 150 pre−heat cooling reflow Time 60180 sec. 60150 sec. Figure 5. Recommended Reflow Soldering Profile http://onsemi.com 5 5 Page

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