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PDF NBXSBB021 Data sheet ( Hoja de datos )
| Número de pieza | NBXSBB021 | |
| Descripción | Clock Oscillator | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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NBXSBA021, NBXSBB021
3.3 V, 266.667 MHz LVPECL
Clock Oscillator
The NBXSBB021/NBXSBA021 single frequency crystal oscillator
(XO) is designed to meet today's requirements for 3.3ĂV LVPECL
clock generation applications. The device uses a high Q fundamental
crystal and Phase Lock Loop (PLL) multiplier to provide
266.667 MHz, ultra low jitter and phase noise LVPECL differential
output.
This device is a member of ON Semiconductor's PureEdget clock
family that provides accurate and precision clock solutions.
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1,000. Frequency stability options available as
either 50 PPM NBXSBA021 or 20 PPM NBXSBB021.
Features
•ăLVPECL Differential Output
•ăUses High Q Fundamental Mode Crystal and PLL Multiplier
•ăUltra Low Jitter and Phase Noise - 0.4 ps (12 kHz - 20 MHz)
•ăOutput Frequency - 266.667 MHz
•ăHermetically Sealed Ceramic SMD Package
•ăRoHS Compliant
•ăOperating Range 3.3 V ±10%
•ăTotal Frequency Stability - ±20 PPM or ±50 PPM
Applications
•ăServers
•ăFully Buffered DIMM
www.DataSheet4U.com
VDD
6
CLK CLK
54
Crystal
PLL
Clock
Multiplier
1 23
OE NC GND
Figure 1. Simplified Logic Diagram
http://onsemi.com
6 PIN CLCC
LN SUFFIX
CASE 848AB
MARKING DIAGRAMS
NBXSBB021
266.667
AWLYYWW
NBXSBA021
266.667
AWLYYWW
NBXSBB021
NBXSBA021
266.667
A
WL
YY
WW
= NBXSBB021 (±20 PPM)*
= NBXSBA021 (±50 PPM)
= Output Frequency (MHz)
= Assembly Location
= Wafer Lot
= Year
= Work Week
ORDERING INFORMATION
Device
Package Shipping†
NBXSBB021LN1TAG* CLCC-6
1000/
(Pb-Free) Tape & Reel
NBXSBA021LN1TAG CLCC-6
1000/
(Pb-Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
* Please contact sales office for availability
©Ă Semiconductor Components Industries, LLC, 2008
May, 2008 - Rev. 1
1
Publication Order Number:
NBXSBB021/D
1 page  
NBXSBA021, NBXSBB021
Table 7. RELIABILITY COMPLIANCE
Parameter
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁShock
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁSolderability
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁVibration
Solvent Resistance
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁThermal Shock
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁMoisture Level Sensitivity
Standard
Mechanical
Mechanical
Mechanical
Mechanical
Environment
Environment
Method
MIL-STD-833, Method 2002, Condition B
MIL-STD-833, Method 2003
MIL-STD-833, Method 2007, Condition A
MIL-STD-202, Method 215
MIL-STD-833, Method 1011, Condition A
MSL1 260°C per IPC/JEDEC J-STD-020D
NBXSBB021/NBXSBA021
Driver
Device
CLK
CLK
Zo = 50 W
Zo = 50 W
D
Receiver
Device
D
50 W
50 W
VTT
VTT = VDD - 2.0 V
Figure 4. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D - Termination of ECL Logic Devices.)
www.DataSheet4U.com
Temperature (°C)
260
217
temp. 260°C
20 - 40 sec. max.
peak
3°C/sec. max.
ramp-up
175
150 pre-heat
reflow
6°C/sec. max.
cooling
Time
60180 sec.
60150 sec.
Figure 5. Recommended Reflow Soldering Profile
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NBXSBB021.PDF ] | |
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