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PDF NTTFS4945N Data sheet ( Hoja de datos )

Número de pieza NTTFS4945N
Descripción Power MOSFET ( Transistor )
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NTTFS4945N
Power MOSFET
30 V, 34 A, Single NChannel, m8FL
Features
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
Power Load Switch
Notebook Battery Management
Motor Control
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol
DraintoSource Voltage
VDSS
GatetoSource Voltage
Continuous Drain
Current RqJA (Note 1)
TA = 25°C
TA = 85°C
VGS
ID
Power Dissipation
(Note 1)
RqJA
TA = 25°C
PD
Value
30
±20
11.2
8.0
2.16
Unit
V
V
A
W
Continuous Drain
Current RqJA 10 s
(Note 1)
TA = 25°C
TA = 85°C
ID
15.7 A
11.3
Power Dissipation
RqJA 10 s (Note 1)
Continuous Drain
Current RqJA (Note 2)
Steady
State
TA = 25°C
TA = 25°C
TA = 85°C
Power Dissipation
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Continuous Drain
Current RqJC (Note 1)
TA = 25°C
TC = 25°C
TC = 85°C
Power Dissipation
RqJC (Note 1)
TC = 25°C
Pulsed Drain Current
TA = 25°C, tp = 10 ms
Current Limited by Pkg.
TA = 25°C
Operating Junction and Storage Temperature
Source Current (Body Diode)
Drain to Source DV/DT
PD
ID
PD
ID
PD
IDM
IDmaxPkg
TJ,
Tstg
IS
dV/dt
4.30
7.1
5.1
0.89
34
24.4
20
102
65
55 to
+150
20
6.0
W
A
W
A
W
A
A
°C
A
V/ns
Single Pulse DraintoSource Avalanche Energy EAS 26.5 mJ
(TJ = 25°C, VDD = 50 V, VGS = 10 V,
IL = 23 Apk, L = 0.1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8from case for 10 s)
TL 260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
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V(BR)DSS
30 V
RDS(on) MAX
9.0 mW @ 10 V
13 mW @ 4.5 V
ID MAX
34 A
NChannel MOSFET
D (58)
G (4)
1
WDFN8
(m8FL)
CASE 511AB
S (1,2,3)
MARKING DIAGRAM
1
SD
S 4945 D
S AYWWG D
GGD
4945
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
NTTFS4945NTAG WDFN8 1500/Tape & Reel
(PbFree)
NTTFS4945NTWG WDFN8 5000/Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2009
October, 2009 Rev. 1
1
Publication Order Number:
NTTFS4945N/D

1 page




NTTFS4945N pdf
NTTFS4945N
TYPICAL CHARACTERISTICS
1400
1200
1000
800
600
400
200
0
0
Ciss
Coss
VGS = 0 V
TJ = 25°C
Crss
5 10 15 20 25
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 7. Capacitance Variation
30
1000
VDD = 15 V
ID = 15 A
VGS = 10 V
100
10
td(off)
tf
tr
td(on)
1
1 10 100
RG, GATE RESISTANCE (W)
Figure 9. Resistive Switching Time Variation
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vs. Gate Resistance
1000
100
10
1 VGS = 20 V
Single Pulse
TC = 25°C
0.1 RDS(on) Limit
Thermal Limit
Package Limit
0.01
0.01 0.1
1
10 ms
100 ms
1 ms
10 ms
dc
10 100
VDS, DRAINTOSOURCE VOLTAGE (V)
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
12
11 TJ = 25°C
10
9
QT
8
7
6
5
4
3 Qgs
2
1
0
0
Qgd
5
QT
10
VDD = 15 V
VGS = 10 V
ID = 20 A
15 20
Qg, TOTAL GATE CHARGE (nC)
Figure 8. GatetoSource and
DraintoSource Voltage vs. Total Charge
30
VGS = 0 V
25
20
TJ = 125°C
15
10
5 TJ = 25°C
0
0.4 0.5 0.6 0.7 0.8 0.9 1.0
VSD, SOURCETODRAIN VOLTAGE (V)
Figure 10. Diode Forward Voltage vs. Current
30
ID = 23 A
25
20
15
10
5
0
25 50 75 100 125 150
TJ, STARTING JUNCTION TEMPERATURE (°C)
Figure 12. Maximum Avalanche Energy vs.
Starting Junction Temperature
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