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Vishay Siliconix - Chip Scale Package Schottky Barrier Rectifier

Numéro de référence FCSP140ETR
Description Chip Scale Package Schottky Barrier Rectifier
Fabricant Vishay Siliconix 
Logo Vishay Siliconix 





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FCSP140ETR fiche technique
FlipKY®, 1 A
FCSP140ETR
Vishay High Power Products
FlipKY®
PRODUCT SUMMARY
IF(AV)
VR
1A
40 V
www.DataSheet4U.com
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
CHARACTERISTICS
IF(AV)
Rectangular waveform
VRRM
IFSM
tp = 5 µs sine
VF 1.0 Apk, TJ = 125 °C
TJ Range
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
VR
VRWM
FEATURES
• Ultralow VF per footprint area
• Low thermal resistance
• One-fifth footprint of SMA
• Super low profile (< 0.7 mm)
• Available tested on tape and reel
• Small footprint, surface mountable
• Low forward voltage drop
• High frequency operation
• Guard ring for enhanced ruggedness and long term
reliability
• Designed for consumer level
DESCRIPTION
True chip-scale packaging is available from Vishay HPP.
The FCSP140ETR surface mount Schottky rectifier has
been designed for applications requiring low forward drop
and very small foot prints on PC boards. Typical applications
are in disk drives, switching power supplies, converters,
freewheeling diodes, battery charging, and reverse battery
protection.
The FlipKY® package is one-fifth the footprint of a
comparable SMA package and has a profile of less than
0.7 mm. Combined with the low thermal resistance of the die
level device, this makes the FlipKY the best device for
applications where printed circuit board space is at a
premium and in extremely thin application environments
such as battery packs, cell phones and PCMCIA cards.
VALUES
1.0
40
250
0.38
- 55 to 150
UNITS
A
V
A
V
°C
FCSP140ETR
40
UNITS
V
Document Number: 93432
Revision: 26-Aug-08
For technical questions, contact: [email protected]
www.vishay.com
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