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PDF 74AUP1G07 Data sheet ( Hoja de datos )

Número de pieza 74AUP1G07
Descripción Low-power buffer
Fabricantes NXP Semiconductors 
Logotipo NXP Semiconductors Logotipo



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74AUP1G07
Low-power buffer with open-drain output
Rev. 02 — 14 June 2007
Product data sheet
1. General description
The 74AUP1G07 is a high-performance, low-power, low-voltage, Si-gate CMOS device,
superior to most advanced CMOS compatible TTL families.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial Power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
The 74AUP1G07 provides the single non-inverting buffer with open-drain output. The
output of the device is an open drain and can be connected to other open-drain outputs to
implement active-LOW wired-OR or active-HIGH wired-AND functions.
2. Features
s Wide supply voltage range from 0.8 V to 3.6 V
s High noise immunity
s Complies with JEDEC standards:
x JESD8-12 (0.8 V to 1.3 V)
x JESD8-11 (0.9 V to 1.65 V)
x JESD8-7 (1.2 V to 1.95 V)
x JESD8-5 (1.8 V to 2.7 V)
x JESD8-B (2.7 V to 3.6 V)
s ESD protection:
x HBM JESD22-A114E Class 3A exceeds 5000 V
x MM JESD22-A115-A exceeds 200 V
x CDM JESD22-C101C exceeds 1000 V
s Low static power consumption; ICC = 0.9 µA (maximum)
s Latch-up performance exceeds 100 mA per JESD 78 Class II
s Inputs accept voltages up to 3.6 V
s Low noise overshoot and undershoot < 10 % of VCC
s IOFF circuitry provides partial Power-down mode operation
s Multiple package options
s Specified from 40 °C to +85 °C and 40 °C to +125 °C

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74AUP1G07 pdf
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74AUP1G07
Low-power buffer with open-drain output
10. Static characteristics
Table 7. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min Typ
Tamb = 25 °C
VIH HIGH-level input voltage
VCC = 0.8 V
VCC = 0.9 V to 1.95 V
0.70 × VCC -
0.65 × VCC -
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
1.6 -
2.0 -
VIL LOW-level input voltage VCC = 0.8 V
VCC = 0.9 V to 1.95 V
--
--
VCC = 2.3 V to 2.7 V
--
VCC = 3.0 V to 3.6 V
--
VOL LOW-level output voltage VI = VIH or VIL
IO = 20 µA; VCC = 0.8 V to 3.6 V
-
-
IO = 1.1 mA; VCC = 1.1 V
--
IO = 1.7 mA; VCC = 1.4 V
IO = 1.9 mA; VCC = 1.65 V
--
--
IO = 2.3 mA; VCC = 2.3 V
IO = 3.1 mA; VCC = 2.3 V
--
--
IO = 2.7 mA; VCC = 3.0 V
--
IO = 4.0 mA; VCC = 3.0 V
--
II
input leakage current
VI = GND to 3.6 V; VCC = 0 V to 3.6 V
-
-
IOZ OFF-state output current VI = VIH; VO = 0 V to 3.6 V; VCC = 0 V -
to 3.6 V
-
IOFF
IOFF
power-off leakage current
additional power-off
leakage current
VI or VO = 0 V to 3.6 V; VCC = 0 V
VI or VO = 0 V to 3.6 V;
VCC = 0 V to 0.2 V
-
-
-
-
ICC
ICC
supply current
additional supply current
VI = GND or VCC; IO = 0 A;
VCC = 0.8 V to 3.6 V
VI = VCC 0.6 V; IO = 0 A; VCC = 3.3 V
-
-
-
-
CI input capacitance
VCC = 0 V to 3.6 V; VI = GND or VCC
-
0.8
CO output capacitance
output enabled; VO = GND; VCC = 0 V
-
1.7
Tamb = 40 °C to +85 °C
VIH HIGH-level input voltage
output disabled; VO = GND; VCC = 0 V
VCC = 0.8 V
VCC = 0.9 V to 1.95 V
- 1.1
0.70 × VCC -
0.65 × VCC -
VCC = 2.3 V to 2.7 V
1.6 -
VCC = 3.0 V to 3.6 V
2.0 -
VIL LOW-level input voltage VCC = 0.8 V
--
VCC = 0.9 V to 1.95 V
--
VCC = 2.3 V to 2.7 V
--
VCC = 3.0 V to 3.6 V
--
74AUP1G07_2
Product data sheet
Rev. 02 — 14 June 2007
Max Unit
-V
-V
-V
-V
0.30 × VCC V
0.35 × VCC V
0.7 V
0.9 V
0.1
0.3 × VCC
0.31
0.31
0.31
0.44
0.31
0.44
±0.1
±0.1
V
V
V
V
V
V
V
V
µA
µA
±0.2 µA
±0.2 µA
0.5 µA
40 µA
- pF
- pF
- pF
-V
-V
-V
-V
0.30 × VCC V
0.35 × VCC V
0.7 V
0.9 V
© NXP B.V. 2007. All rights reserved.
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74AUP1G07
Low-power buffer with open-drain output
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
SOT353-1
D
y
Z
5
4
13
e
e1
bp
wM
EA
X
c
HE
vM A
A2
A1
A
(A3)
Lp
L
detail X
θ
0 1.5 3 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c D(1) E(1) e
mm
1.1
0.1
0
1.0
0.8
0.15
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
e1
1.3
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT353-1
MO-203
SC-88A
HE L Lp v w y Z(1) θ
2.25
2.0
0.425
0.46
0.21
0.3
0.1
0.1
0.60
0.15
7°
0°
EUROPEAN
PROJECTION
ISSUE DATE
00-09-01
03-02-19
Fig 9. Package outline SOT353-1 (TSSOP5)
74AUP1G07_2
Product data sheet
Rev. 02 — 14 June 2007
© NXP B.V. 2007. All rights reserved.
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