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PDF ADP3110A Data sheet ( Hoja de datos )

Número de pieza ADP3110A
Descripción 12V MOSFET Driver
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ADP3110Awww.DataSheet4U.com
Dual Bootstrapped, 12 V
MOSFET Driver with Output
Disable
The ADP3110A is a single Phase 12 V MOSFET gate drivers
optimized to drive the gates of both highside and lowside power
MOSFETs in a synchronous buck converter. The highside and
lowside driver is capable of driving a 3000 pF load with a 25 ns
propagation delay and a 30 ns transition time.
With a wide operating voltage range, high or low side MOSFET
gate drive voltage can be optimized for the best efficiency. Internal
adaptive nonoverlap circuitry further reduces switching losses by
preventing simultaneous conduction of both MOSFETs.
The floating top driver design can accommodate VBST voltages as
high as 35 V, with transient voltages as high as 40 V. Both gate outputs
can be driven low by applying a low logic level to the Output Disable
(OD) pin. An Undervoltage Lockout function ensures that both driver
outputs are low when the supply voltage is low, and a Thermal
Shutdown function provides the IC with overtemperature protection.
Features
AllInOne Synchronous Buck Driver
Bootstrapped HighSide Drive
One PWM Signal Generates Both Drives
Anticross Conduction Protection Circuitry
OD for Disabling the Driver Outputs Meets CPU VR Requirement
when Used with Patented FlexModet Controller
These are PbFree Devices
Applications
Multiphase Desktop CPU Supplies
SingleSupply Synchronous Buck Converters
© Semiconductor Components Industries, LLC, 2008
August, 2008 Rev. 4
1
http://onsemi.com
8
1
SO8
D SUFFIX
CASE 751
MARKING
DIAGRAMS
8
3110A
ALYW
G
1
1
DFN8
MN SUFFIX
CASE 506BJ
18
L3E
ALYWG
G
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = PbFree Package
PIN CONNECTIONS
BST 1
IN
OD
VCC
1
8 DRVH
SWN
PGND
DRVL
8
BST DRVH
IN SWN
OD PGND
VCC DRVL
(Top View)
ORDERING INFORMATION
Device
Package Shipping
ADP3110AKRZ
SO8
98 Units / Rail
(PbFree)
ADP3110AKRZRL SO8 2500 Tape & Reel
(PbFree)
ADP3110AKCPZRL DFN8 5000 Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
ADP3110A/D

1 page




ADP3110A pdf
ADP3110A
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APPLICATIONS INFORMATION
Theory of Operation
The ADP3110A are single phase MOSFET drivers
designed for driving two Nchannel MOSFETs in a
synchronous buck converter topology. The ADP3110A will
operate from 5.0 V or 12 V, but have been optimized for high
current multiphase buck regulators that convert 12 V rail
directly to the core voltage required by complex logic chips.
A single PWM input signal is all that is required to properly
drive the highside and the lowside MOSFETs. Each driver
is capable of driving a 3 nF load at frequencies up to 1 MHz.
LowSide Driver
The lowside driver is designed to drive a
groundreferenced low RDS(on) NChannel MOSFET. The
voltage rail for the lowside driver is internally connected to
the VCC supply and PGND.
HighSide Driver
The highside driver is designed to drive a floating low
RDS(on) Nchannel MOSFET. The gate voltage for the high
side driver is developed by a bootstrap circuit referenced to
Switch Node (SW) pin.
The bootstrap circuit is comprised of an external diode,
and an external bootstrap capacitor. When the ADP3110A
are starting up, the SW pin is at ground, so the bootstrap
capacitor will charge up to VCC through the bootstrap diode
See Figure 4. When the PWM input goes high, the highside
driver will begin to turn on the highside MOSFET using the
stored charge of the bootstrap capacitor. As the highside
MOSFET turns on, the SW pin will rise. When the highside
MOSFET is fully on, the switch node will be at 12 V, and the
BST pin will be at 12 V plus the charge of the bootstrap
capacitor (approaching 24 V).
The bootstrap capacitor is recharged when the switch
node goes low during the next cycle.
Safety Timer and Overlap Protection Circuit
It is very important that MOSFETs in a synchronous buck
regulator do not both conduct at the same time. Excessive
shootthrough or cross conduction can damage the
MOSFETs, and even a small amount of cross conduction
will cause a decrease in the power conversion efficiency.
The ADP3110A prevent cross conduction by monitoring
the status of the external mosfets and applying the
appropriate amount of “deadtime” or the time between the
turn off of one MOSFET and the turn on of the other
MOSFET.
When the PWM input pin goes high, DRVL will go low
after a propagation delay (tpdlDRVL). The time it takes for
the lowside MOSFET to turn off (tfDRVL) is dependent on
the total charge on the lowside MOSFET gate. The
ADP3110A monitor the gate voltage of both MOSFETs and
the switchnode voltage to determine the conduction status of
the MOSFETs. Once the lowside MOSFET is turned off an
internal timer will delay (tpdhDRVH) the turn on of the
highside MOSFET
Likewise, when the PWM input pin goes low, DRVH will
go low after the propagation delay (tpdDRVH). The time to
turn off the highside MOSFET (tfDRVH) is dependent on
the total gate charge of the highside MOSFET. A timer will
be triggered once the highside mosfet has stopped
conducting, to delay (tpdhDRVL) the turn on of the
lowside MOSFET
Power Supply Decoupling
The ADP3110A can source and sink relatively large
currents to the gate pins of the external MOSFETs. In order
to maintain a constant and stable supply voltage (VCC) a low
ESR capacitor should be placed near the power and ground
pins. A 1 mF to 4.7 mF multi layer ceramic capacitor (MLCC)
is usually sufficient.
Input Pins
The PWM input and the Output Disable pins of the
ADP3110A have internal protection for Electro Static
Discharge (ESD), but in normal operation they present a
relatively high input impedance. If the PWM controller does
not have internal pulldown resistors, they should be added
externally to ensure that the driver outputs do not go high
before the controller has reached its under voltage lockout
threshold. The NCP5381 controller does include a passive
internal pulldown resistor on the driveon output pin.
Bootstrap Circuit
The bootstrap circuit uses a charge storage capacitor
(CBST) and the internal (or an external) diode. Selection of
these components can be done after the highside MOSFET
has been chosen. The bootstrap capacitor must have a
voltage rating that is able to withstand twice the maximum
supply voltage. A minimum 50 V rating is recommended.
The capacitance is determined using the following equation:
CBST
+
QGATE
DVBST
where QGATE is the total gate charge of the highside
MOSFET, and DVBST is the voltage droop allowed on the
highside MOSFET drive. For example, a NTD60N03 has
a total gate charge of about 30 nC. For an allowed droop of
300 mV, the required bootstrap capacitance is 100 nF. A
good quality ceramic capacitor should be used.
The bootstrap diode must be rated to withstand the
maximum supply voltage plus any peak ringing voltages
that may be present on SW. The average forward current can
be estimated by:
IF(AVG) + QGATE fMAX
where fMAX is the maximum switching frequency of the
controller. The peak surge current rating should be checked
incircuit, since this is dependent on the source impedance
of the 12 V supply and the ESR of CBST.
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