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Advanced Semiconductor Business - Internally Matched LNA Module

Numéro de référence ACL4275T2
Description Internally Matched LNA Module
Fabricant Advanced Semiconductor Business 
Logo Advanced Semiconductor Business 





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ACL4275T2 fiche technique
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plerowTM ACL4275T2
Internally Matched LNA Module
Features
· S21 = 21.8 dB @ 4200 MHz
= 20.2 dB @ 4350 MHz
· NF of 1.25 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3 @ Low Current
Description
The plerowTM ACL-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ. @ T = 25°C, Vs = 5 V, Freq. = 4275 MHz, Zo.sys = 50 ohm
Parameter
Unit Specifications
Min Typ Max
Frequency Range
MHz
4200
4350
Gain
dB 20 21
Gain Flatness
dB
± 0.8
± 0.9
Noise Figure
dB
1.25 1.35
Output IP3 (1)
dBm 29 30
S11 / S22 (2)
dB
-18 / -10
Output P1dB
dBm 13 14
Switching Time (3)
µsec
-
Supply Current
mA
50 60
Supply Voltage
V
5
Impedance
50
Max. RF Input Power
dBm
C.W 29 ~ 31 (before fail)
Package Type & Size
mm Surface Mount Type, 10Wx10Lx3.8H
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of 4 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
2-stage Single Type
More Information
Website: www.asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Outline Drawing (Unit: mm)
plerow
ACL4275T2
ASB Inc.
(Top View)
Solder Stencil Area
(Side View)
(Bottom View)
Pin Number
2
5
6
Others
Function
RF In
RF Out
Vs
Ground
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø0.4 plated thru holes to ground plane
1/3
(Recommended Footprint)
www.asb.co.kr
November 2008

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