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PDF CHR3693 Data sheet ( Hoja de datos )
| Número de pieza | CHR3693 | |
| Descripción | 21-26.5GHz Integrated Down converter | |
| Fabricantes | United Monolithic Semiconductors | |
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Hay una vista previa y un enlace de descarga de CHR3693 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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CHR3693
www.datasheet4u.com
21-26.5GHz Integrated Down converter
GaAs Monolithic Microwave IC
Description
The CHR3693 is a multifunction chip, which
integrates a balanced cold FET mixer, a time
two multiplier, and a RF self biased LNA. It is
designed for a wide range of applications,
typically commercial communication systems.
The backside of the chip is both RF and DC
grounded. This helps to simplify the assembly
process.
The circuit is manufactured with a PM-HEMT
process, 0.25µm gate length, via holes
through the substrate and air bridges.
It is supplied in chip form.
Main Features
■ Broadband performance 21-26.5GHz
■ 18dB gain
■ -7dBm input IP3
■ 18dB image rejection
■ DC power consumption: 4V, 160mA
■ Chip size: 2,45 x 2,45 x 0,1mm
Main Characteristics
Tamb=25°C, Vd=4V
LO
Vgx
I X2
Q Vdx
Vgm
Vdl
24
22
20
18
16
14
12
10
20.5
RF
Conversion Gain (Inf. & Sup. Mode)
F_IF=2GHz
F_IF=3.5GHz
21.5 22.5 23.5 24.5 25.5 26.5
RF Frequency (GHz)
Symbol
Parameter
FRF RF frequency range
FLO LO frequency range
FIF IF frequency range
Gc Conversion gain
Min Typ Max Unit
21 26.5 GHz
9 14 GHz
DC 3.5 GHz
18 dB
ESD Protection: Electrostatic discharge sensitive device. Observe handling precautions!
Ref. : DSCHR36937011 - 11 Jan 07
1/6
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
1 page  
21-26.5GHz MFC Down Converter
Chip Assembly and Mechanical Data
CHR3693
www.datasheet4u.com
I
OUT
LO
IN
X2
120pF To Vgx DC Gate Supply
120pF To Vdx DC Drain Supply
Q
OUT
120pF To Vgm DC Gate Supply
120pF To Vdl DC Drain Supply
RF
IN
Note:
Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended.
Bonding pad positions
(Chip thickness: 100µm. All dimensions are in micrometers)
Ref. DSCHR36937011 - 11 Jan 07
5/6 Specifications subject to change without notice
Route Départementale 128, B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CHR3693.PDF ] | |
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