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PDF UPC1251 Data sheet ( Hoja de datos )
| Número de pieza | UPC1251 | |
| Descripción | SINGLE POWER SUPPLY DUAL OPERATIONAL AMPLIFIERS | |
| Fabricantes | NEC | |
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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG
www.datasheet4u.com SINGLE POWER SUPPLY DUAL OPERATIONAL AMPLIFIERS
<R> DESCRIPTION
The μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG are dual operational amplifiers which are designed to
operate for a single power supply. It includes features of low-voltage operation, a common-mode input voltage that
range from V− (GND) level, an output from a V− (GND) level that is determined by the output stage of class C push-
pull circuit and a 50 μA(TYP.) constant current, and a low current consumption.
In addition, this can operate at both positive and negative power supply and it can be extensively used in various
amplifier circuits.
The μ PC1251GR-9LG, μ PC1251MP-KAA which expands temperature type is suited for wide operating ambient
temperature use, and μ PC358GR-9LG is used for general purposes.
A DC parameter selection that is compatible to operational amplifiers is also available.
μ PC451GR-9LG, μ PC324GR-9LG which are quad types with the same circuit configuration are also available as
series of operational amplifiers.
<R> FEATURES
• Input Offset Voltage
±2 mV (TYP.)
• Internal frequency compensation
• Input Offset Current
±5 nA (TYP.)
• Output short-circuit protection
• Large Signal Voltage Gain 100000 (TYP.)
• Small Package
The mounting area is reduced to 40% or 66% compared to the conventional 8-pin plastic SOP as shown in the
following diagram.
Package
Subject part number
Outline comparison
Standard SOP
μ PC1251G2,
μ PC358G2
TSSOP
μ PC1251GR-9LG,
μ PC358GR-9LG
TSSOP (2.8 x 2.9)
μ PC1251MP-KAA
(Mounting area ratio)
6.5 4.4
6.4
5.2
(100%)
3.15
(60%)
2.8 4.0
2.9
(34%)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. G17929EJ3V0DS00 (3rd edition)
Date Published December 2007 NS
2006, 2007
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
1 page  
μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG
<R> TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.) (Reference value)
600
PT vs. TA
500
www.datasheet4u.com
400
300
200
With 100 mm x 100 mm,
thickness 1 mm glass epoxy
100 substrate (refer to "ABSOLUTE
MAXIMUM RATINGS Note 4" )
0
0 20 40 60 80
100 120 140
TA - Operating Ambient Temperature - °C
2
RL = ∞
IO = 0 A
1.5
1 125°C
ICC vs. V+
TA = 25°C
0.5
−40°C
0
0 10 20 30 40
V+ - Power Supply Voltage - V (V− = GND)
VIO vs. V+
3
2
1
0
-1
-2
-3
0 10 20 30 40
V+ - Power Supply Voltage - V (V− = GND)
VIO vs. TA
3
2
1
0
-1
-2 V+ = +5 V, V− = GND
each 5 samples data
-3
-50 0 50 100 150
TA - Operating Ambient Temperature - °C
IB vs. V+
30
20
IB vs. TA
30
V+ = +15 V
V− = GND
20
10 10
0
0 10 20 30 40
V+ - Power Supply Voltage - V (V− = GND)
0
-50 0 50 100 150
TA - Operating Ambient Temperature - °C
Data Sheet G17929EJ3V0DS
5
5 Page 
μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG
<R> RECOMMENDED SOLDERING CONDITIONS
The μ PC1251GR-9LG, μ PC1251MP-KAA, μ PC358GR-9LG should be soldered and mounted under the
following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
www.datashFeeotr4tue.ccohmnical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
μ PC1251GR-9LG-A Note, μ PC1251GR(5)-9LG-A Note,
μ PC358GR-9LG-A Note, μ PC358GR(5)-9LG-A Note: 8-pin plastic TSSOP (5.72 mm (225))
μ PC1251MP-KAA-A Note, μ PC1251MP(5)-KAA-A Note: 8-pin plastic TSSOP (2.8 x 2.9)
Process
Conditions
Infrared ray reflow
Peak temperature: 260°C, Reflow time: 60 seconds or less (at 220°C or higher),
Maximum number of reflow processes: 3 times.
Wave soldering
Partial heating method
Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum
number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
Pin temperature: 350°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Note Pb-free (This product does not contain Pb in external electrode and other parts.)
Symbol
IR60-00-3
WS60-00-1
P350
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the
device will be damaged by heat stress.
Remark Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
<R> REFERENCE DOCUMENTS
Document Name
QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES
SEMICONDUCTOR DEVICE MOUNT MANUAL
NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROL
SYSTEM-STANDARD LINEAR IC
REVIEW OF QUALITY AND RELIABILITY HANDBOOK
NEC SEMICONDUCTOR DEVICE RELIBIALITY/QUALITY CONTROL
SYSTEM
Document No.
C11531E
http://www.necel.com/pkg/en/mount/index.html
IEI-1212
C12769E
C10983E
Data Sheet G17929EJ3V0DS
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet UPC1251.PDF ] | |
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