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Microsemi Corporation - InGaP HBT 4.5 - 6GHz Power Amplifier

Numéro de référence LX5506
Description InGaP HBT 4.5 - 6GHz Power Amplifier
Fabricant Microsemi Corporation 
Logo Microsemi Corporation 





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LX5506 fiche technique
LX5506
TM ® InGaP HBT 4.5 – 6GHz Power Amplifier
PRODUCTION DATA SHEET
DESCRIPTION
www.datTahsheeeLtX4u5.c5o0m6 is a power amplifier
designed for the FCC Unlicensed
National Information Infrastructure
(U-NII) band, HyperLAN2 and Japan
WLAN applications in the 4.9-5.95
GHz frequency range. The PA is
implemented as a three-stage
monolithic microwave integrated
circuit (MMIC) with active bias and
complete on-chip input matching. The
device is manufactured with an
InGaP/GaAs Heterojunction Bipolar
Transistor (HBT) IC process
(MOCVD). It operates at a single
positive voltage supply of 3.3V
(nominal), with +26dBm of P1dB and
up to 23dB power gain in the 5.15 -
5.85GHz frequency range with a
simple output matching capacitor pair.
For OFDM operation (64QAM,
54Mbps), the PA provides +18dBm
linear output power with a very low
EVM (Error-Vector Magnitude) of
3%, and consumes about 190mA total
DC current. At higher supply voltage
of 5V, the same device provides
+24dBm linear OFDM output power
with 5% EVM.
The LX5506 is available in a 16-pin
3mmx3mm micro-lead package (MLP).
The compact footprint, low profile, and
excellent thermal capability of the MLP
package makes the LX5506 an ideal
solution for broadband, high-gain
power amplifier requirements for IEEE
802.11a, and HiperLAN2 portable
WLAN applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATURES
ƒ Advanced InGaP HBT
ƒ Single-Polarity 3.3V Supply
ƒ EVM ~ 3% at Pout=18dBm for
64QAM/ 54Mbps OFDM
ƒ P1dB ~ +26dBm
ƒ Power Gain ~ 23dB at
5.25GHz for Icq ~100mA
ƒ Power Gain ~ 21dB at
5.85GHz for Icq ~100mA
ƒ Total Current ~190mA at
Pout=18dBm at 5.25GHz
ƒ ACPR ~ -50dBc at 30MHz
Offset at Pout=18dBm
ƒ Complete On-Chip Input Match
ƒ Simple Output Capacitor Match
ƒ Small Footprint: 3x3mm2
ƒ Low Profile: 0.9mm
APPLICATIONS
ƒ FCC U-NII Wireless
ƒ IEEE 802.11a
ƒ HiperLAN2
ƒ 5GHz Cordless Phone
PRODUCT HIGHLIGHT
Copyright © 2003
Rev. 1.2c, 2005-08-18
PACKAGE ORDER INFO
LQ
Plastic MLPQ
16-Pin
LX5506LQ
RoHS Compliant / Pb-free Transition DC: 0418
Note: Available in Tape & Reel. Append the letters “TR” to
the part number. (i.e. LX5506LQ-TR)
This device is classified as ESD Level 0 in accordance with
JESD22-A114-B, (HBM) testing. Appropriate ESD
procedures should be observed when handling this device.
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
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