DataSheetWiki


TCLAMP3302N fiches techniques PDF

Semtech Corporation - Low Capacitance TVS

Numéro de référence TCLAMP3302N
Description Low Capacitance TVS
Fabricant Semtech Corporation 
Logo Semtech Corporation 





1 Page

No Preview Available !





TCLAMP3302N fiche technique
www.datasheet4u.com
TClamp3302N
Low Capacitance TVS
for Ethernet and Telecom Interfaces
PROTECTION PRODUCTS - TransClampΤΜ
Description
A TransClampΤΜ is a low capacitance TVS array designed
to protect high speed data interfaces. This series has
been specifically designed to protect sensitive compo-
nents which are connected to data and transmission
lines from overvoltage caused by ESD (electrostatic
discharge), CDE (Cable Discharge Events), and Light-
ning.
These devices integrate low capacitance, surge-rated
compensation diodes with a high power transient
voltage suppressor (TVS). The compensation diodes
are arranged in a bridge pattern allowing the device to
be connected in common mode and/or differential
mode. This allows the designer maximum flexibility and
reduces parts count. The capacitance of the device is
limited to 12pF maximum from line-to-line to ensure
correct signal transmission on high-speed lines.
These devices may be used to meet Telcordia GR-1089-
CORE short-haul (intra-building) surge requirements and
will withstand a minimum 100 A surge for a 2/10µs
pulse.
The TClampTM3302N is in a 10-pin, RoHS/WEEE compli-
ant, SLP2626P10 package. It measures 2.6 x 2.6 x
0.60mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPdAu. They are
particularly well suited for applications where board
space is at a premium such as integrated connectors/
magnetics and carrier class Ethernet equipment.
Features
‹ Transient protection for high-speed data lines to
Bellcore 1089 (Intra-Building) 100A (2/10µs)
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) L5, 95A (8/20µs)
‹ Low capacitance (12pF line-to-line)
‹ Low operating voltages (3.3V)
‹ Low clamping voltage
‹ Small SLP Package saves board space
‹ Solid-state technology
Mechanical Characteristics
‹ SLP2626P10 10L package
‹ RoHS/WEEE Compliant
‹ Nominal Dimensions: 2.6 x 2.6 x 0.60 mm
‹ Lead Pitch: 0.5mm
‹ Molding compound flammability rating: UL 94V-0
‹ Marking: Marking Code
‹ Packaging: Tape and Reel
Applications
‹ 10/100/1000 Ethernet
‹ T3/E3
‹ Integrated Magnetics
‹ Carrier Class Equipment
‹ Customer Premise Equipment
Circuit Diagram
LINE 1
(1, 2, 3)
Center Tab
LINE 2
(8, 9, 10)
Revision 01/17/2008
Package Configuration
2.60
1 2 CL
CL 2.60
0.50 BSC
0.60
10 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com

PagesPages 9
Télécharger [ TCLAMP3302N ]


Fiche technique recommandé

No Description détaillée Fabricant
TCLAMP3302N Low Capacitance TVS Semtech Corporation
Semtech Corporation

US18650VTC5A

Lithium-Ion Battery

Sony
Sony
TSPC106

PCI Bus Bridge Memory Controller

ATMEL
ATMEL
TP9380

NPN SILICON RF POWER TRANSISTOR

Advanced Semiconductor
Advanced Semiconductor


www.DataSheetWiki.com    |   2020   |   Contactez-nous  |   Recherche