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K7N401801B fiches techniques PDF

Samsung semiconductor - (K7N401801B / K7N403601B) 128Kx36 & 256Kx18 Pipelined NtRAM

Numéro de référence K7N401801B
Description (K7N401801B / K7N403601B) 128Kx36 & 256Kx18 Pipelined NtRAM
Fabricant Samsung semiconductor 
Logo Samsung semiconductor 





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K7N401801B fiche technique
K7N403601B
K7N401801B
128Kx36 & 256Kx18 Pipelined NtRAMTM
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128Kx36 & 256Kx18-Bit Pipelined NtRAMTM
Revision History
Rev. No.
History
0.0 1. Initial document.
0.1 1. Changed DC parameters
Icc ; from 350mA to 290mA at -16,
from 330mA to 270mA at -15,
from 300mA to 250mA at -13,
ISB1 ; from 100mA to 80mA
0.2 1. Add x32 org. and industrial temperature
1.0 1. Final spec release
2. Changed Pin Capacitance
- Cin ; from 5pF to 4pF
- Cout ; from 7pF to 6pF
2.0 1. Remove x32 organization
2. Remove -16 speed bin
Draft Date
May. 15. 2001
June. 12. 2001
Remark
Preliminary
Preliminary
Aug. 11. 2001
Nov. 15. 2001
Preliminary
Final
Nov. 17. 2003
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
- 1 - Nov. 2003
Rev 2.0

PagesPages 18
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