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PDF RCLAMP0503F Data sheet ( Hoja de datos )
| Número de pieza | RCLAMP0503F | |
| Descripción | TVS Array | |
| Fabricantes | Semtech Corporation | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de RCLAMP0503F (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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PROTECTION PRODUCTS - RailClamp
www.DataSheet4U.com
Description
RailClamps are surge rated diode arrays designed to
protect high speed data interfaces. This series has
been specifically designed to protect sensitive compo-
nents which are connected to data and transmission
lines from overvoltage caused by ESD (electrostatic
discharge), CDE (Cable Discharge Events), and EFT
(electrical fast transients).
The unique design incorporates surge rated, low
capacitance steering diodes and a TVS diode in a
single package. During transient conditions, the
steering diodes direct the transient to either the
positive side of the power supply line or to ground. The
internal TVS diode prevents over-voltage on the power
line, protecting any downstream components.
The low capacitance array configuration allows the user
to protect three high-speed data or transmission lines.
The low inductance construction minimizes voltage
overshoot during high current surges. This device is
optimized for ESD protection of USB OTG and SIM
interfaces. They may be used to meet the ESD immu-
nity requirements of IEC 61000-4-2, Level 4 (±15kV
air, ±8kV contact discharge).
RClamp0503F
RailClamp
TVS Array for USB OTG Interfaces
Features
Transient protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Array of surge rated diodes with internal TVS Diode
Small package saves board space
Protects three I/O lines & power line
Low capacitance (<3pF) for high-speed interfaces
Low clamping voltage
Low operating voltage: 5.0V
Solid-state silicon-avalanche technology
Mechanical Characteristics
EIAJ SC-70 5L package
Molding compound flammability rating: UL 94V-0
Lead Finish: Matte Tin
RoHS/WEEE Compliant
Marking : F53
Packaging : Tape and Reel per EIA 481
Applications
USB OTG interfaces
SIM Ports
Video Graphics Cards
Personal Digital Assistants (PDAs)
Monitors and Flat Panel Displays
Portable Electronics
Microcontroller Input Protection
Circuit Diagram
Schematic & PIN Configuration
5
1 34
2
Revision 04/05/2005
SC-70 5L (Top View)
1 www.semtech.com
1 page  
RClamp0503F
PROTECTION PRODUCTS
Appwlwicw.aDtaitaoSnhesetI4nUf.coormmation
Device Connection Options for Protection of
Three High-Speed Data Lines
This device is designed to protect three data lines from
transient over-voltages by clamping them to a fixed
reference. When the voltage on the protected line
exceeds the reference voltage (plus diode VF) the
steering diodes are forward biased, conducting the
transient current away from the sensitive circuitry.
Data lines are connected at pins 1, 3, and 4. The
negative reference is connected at pin 2. This pin
should be connected directly to a ground plane on the
board for best results. The path length is kept as short
as possible to minimize parasitic inductance.
Connect pin 5 directly to the positive supply rail (VCC).
In this configuration the data lines are referenced to
the supply voltage. The internal TVS diode prevents
over-voltage on the supply rail.
Protecting USB On-The-Go (OTG) Interfaces
The USB OTG interface consists of the Data (D+ and D-
) lines, 5.25V voltage bus, and an ID pin. Since these
pins are part of the connector, they are vulnerable to
ESD and cable discharge events. The RClamp0503F is
designed to protect all four USB OTG connections. The
lines can be easily routed through the device as shown
in the layout example.
Data Line and Power Supply Protection Using Vcc as
reference
USB On-The-Go Port Protection
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
USB On-The-Go Port Layout Example
2005 Semtech Corp.
5
www.semtech.com
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet RCLAMP0503F.PDF ] | |
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