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PDF HMC649 Data sheet ( Hoja de datos )

Número de pieza HMC649
Descripción GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER
Fabricantes Hittite Microwave Corporation 
Logotipo Hittite Microwave Corporation Logotipo



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No Preview Available ! HMC649 Hoja de datos, Descripción, Manual

v00.0607
Typical Applications
The HMC649 is ideal for:
• EW Receivers
5 • Weather & Military Radar
• Satellite Communications
www.DataSheet4U.coBmeamforming Modules
• Phase Cancellation
Functional Diagram
HMC649
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 3 - 6 GHz
Features
Low RMS Phase Error: 3°
Low Insertion Loss: 6.5 dB
High Linearity: +44 dBm
Positive Control Logic
360° Coverage, LSB = 5.625°
Die Size: 4.65 x 1.9 x 0.1 mm
General Description
The HMC649 is a 6-bit digital phase shifter
die which is rated from 3 to 6 GHz, providing 360
degrees of phase coverage, with a LSB of 5.625
degrees. The HMC649 features low RMS phase error
of 3 degrees and extremely low insertion loss variation
of ±0.5 dB across all phase states. This high accuracy
phase shifter is controlled with positive control logic of
0/+5V, and is internally matched to 50 Ohms with no
external components.
5 - 64
Electrical Specifications, TA = +25° C,
Vss= -5V, Vdd= +5V, Control Voltage = 0/ +5V, 50 Ohm System
Parameter
Frequency Range
Insertion Loss*
Input Return Loss*
Output Return Loss*
Phase Error*
RMS Phase Error
Insertion Loss Variation*
Input Power for 1 dB Compression
Input Third Order Intercept
Control Voltage Current
Bias Control Current
*Note: Major States Shown
Min.
3
Typ.
6.5
12
10
±5
3
±0.5
29
44
<250
<12
Max.
6
9
+15 / -20
Units
GHz
dB
dB
dB
deg
deg
dB
dBm
dBm
μA
mA
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

1 page




HMC649 pdf
v00.0607
Outline Drawing
5
www.DataSheet4U.com
HMC649
GaAs MMIC 6-BIT DIGITAL
PHASE SHIFTER, 3 - 6 GHz
Die Packaging Information [1]
Standard
Alternate
GP-1
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS IN INCHES (MILLIMETERS)
2. DIE THICKNESS IS 0.004
3. BACKSIDE METALLIZATION: GOLD
4. BACKSIDE METAL IS GROUND
5. BOND PADS METALLIZATION: GOLD
6. OVERALL DIE SIZE ±0.002
5 - 68
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

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