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PDF IP4064CX8LF Data sheet ( Hoja de datos )
| Número de pieza | IP4064CX8LF | |
| Descripción | Integrated SIM card passive filter array | |
| Fabricantes | NXP Semiconductors | |
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IP4064CX8/LF; IP4364CX8/LF
Integrated SIM card passive filter array with ESD protection to
IEC61000-4-2, level 4
Rev. 01 — 12 November 2007
Product data sheet
1. Product profile
1.1 General description
The IP4064CX8/LF and IP4364CX8/LF are 3-channel RC low-pass filter arrays which are
designed to provide filtering of undesired RF signals in the 800 MHz to 3000 MHz
frequency band. In addition, the IP4064CX8/LF and IP4364CX8/LF incorporate diodes to
provide protection to downstream components against Electrostatic Discharge (ESD)
voltages as high as ±15 kV contact and > ±15 kV air discharge, far exceeding
IEC61000-4-2, level 4. The IP4064CX8/LF and IP4364CX8/LF are fabricated using
monolithic silicon technology and integrate three resistors and seven high-level
ESD-protection diodes in a single wafer level chip-scale package. These features make
the IP4064CX8/LF and IP4364CX8/LF ideal for use in applications requiring component
miniaturization, such as mobile phone handsets, cordless telephones and personal digital
devices.
1.2 Features
I Pb-free and RoHS compliant
I 3-channel SIM card interface integrated RC-filter array
I 100 Ω/100 Ω/47 Ω series channel resistors integrated
I Downstream ESD protection up to ±15 kV (contact) exceeding IEC61000-4-2, level 4
I Wafer level chip-scale package with 0.4 mm (IP4364CX8/LF) and 0.5 mm
(IP4064CX8/LF) pitch
1.3 Applications
I SIM interfaces in e.g. cellular and PCS mobile handsets
1 page  
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NXP Semiconductors
IP4064CX8/LF; IP4364CX8/LF
Integrated SIM card passive filter array with ESD protection
7. Application information
7.1 Insertion loss
The IP4064CX8/LF and IP4364CX8/LF is mainly designed as an EMI/RFI filter for SIM
card interfaces. The insertion loss in a 50 Ω system for all three channels of the
IP4364CX8/LF is shown in Figure 5 as an example. The insertion loss of IP4064CX8/LF is
identical. The insertion loss of the three channels was measured with a test PCB utilizing
laser drilled micro-via holes that connect the PCB ground plane to the ground pins.
IN
50 Ω
DUT
TEST BOARD
OUT
50 Ω
Vgen
001aag218
Fig 4. Frequency response set-up
0
s21
(dB)
−10
001aag219
(1)
−20
(2)
−30 (3)
−40
10−1
1
10 102 103 104
f (MHz)
(1) Pin B1 to B3.
(2) Pin A2 to A3.
(3) Pin C1 to C3.
Fig 5. Typical IP4064CX8/LF and IP4364CX8/LF frequency response curves
IP4064CX8LF_IP4364CX8LF_1
Product data sheet
Rev. 01 — 12 November 2007
© NXP B.V. 2007. All rights reserved.
5 of 13
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NXP Semiconductors
IP4064CX8/LF; IP4364CX8/LF
Integrated SIM card passive filter array with ESD protection
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
9.3.4 Cleaning
Cleaning can be done after reflow soldering.
10. Abbreviations
Table 6. Abbreviations
Acronym
Description
DUT
Device Under Test
EMI ElectroMagnetic Interference
ESD
ElectroStatic Discharge
PCB
Printed-Circuit Board
PCS
Personal Communication System
RFI Radio Frequency Interference
RoHS
Restriction Of the use of certain Hazardous Substances directive
SIM Subscriber Identity Module
11. Revision history
Table 7. Revision history
Document ID
Release date
IP4064CX8LF_IP4364CX8LF_1 20071112
Data sheet status Change notice
Product data sheet -
Supersedes
-
IP4064CX8LF_IP4364CX8LF_1
Product data sheet
Rev. 01 — 12 November 2007
© NXP B.V. 2007. All rights reserved.
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| PDF Descargar | [ Datasheet IP4064CX8LF.PDF ] | |
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