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ICS83026I-01 fiches techniques PDF

Integrated Device Technology - 1-TO-2 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER

Numéro de référence ICS83026I-01
Description 1-TO-2 DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
Fabricant Integrated Device Technology 
Logo Integrated Device Technology 





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ICS83026I-01 fiche technique
ICS83026I-01
LOW SKEW, 1-TO-2
DIFFERENTIAL-TO-LVCMOS/LVTTL FANOUT BUFFER
GENERAL DESCRIPTION
The ICS83026I-01 is a low skew, 1-to-2 Dif-
ICS ferential-to-LVCMOS/LVTTL Fanout Buffer and
HiPerClockS™ a member of the HiPerClockS ™ family of
High Performance Clock Solutions from
IDT. The differential input can accept most dif-
ferential signal types (LVPECL, LVDS, LVHSTL, HCSL and
SSTL) and translate to two single-ended LVCMOS/LVTTL out-
puts. The small 8-lead SOIC footprint makes this device ideal
www.DataSheefto4Ur u.csoemin applications with limited board space.
FEATURES
Two LVCMOS / LVTTL outputs
Differential CLK, nCLK input pair
CLK, nCLK pair can accept the following differential
input levels: LVPECL, LVDS, LVHSTL, HCSL, SSTL
Maximum output frequency: 350MHz
Output skew: 15ps (maximum)
Part-to-part skew: 600ps (maximum)
Additive phase jitter, RMS: 0.03ps (typical)
Small 8 lead SOIC package saves board space
3.3V core, 3.3V, 2.5V or 1.8V output operating supply
-40°C to 85°C ambient operating temperature
Available in both standard (RoHS 5) and lead-free RoHS
(6) packages
BLOCK DIAGRAM
CLK
nCLK
OE
Q0
Q1
83026BMI-01
PIN ASSIGNMENT
VDD
CLK
nCLK
OE
1
2
3
4
8 VDDO
7 Q0
6 Q1
5 GND
ICS83026I-01
8-Lead SOIC
3.8mm x 4.8mm, x 1.47mm package body
M Package
Top View
VDD
CLK
nCLK
OE
1
2
3
4
8 VDDO
7 Q0
6 Q1
5 GND
ICS83026I-01
8-Lead TSSOP
4.40mm x 3.0mm x 0.925mm
package body
G Package
Top View
1 REV. A OCTOBER 22, 2007

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