|
|
PDF JS28F256P30T95 Data sheet ( Hoja de datos )
| Número de pieza | JS28F256P30T95 | |
| Descripción | Embedded Memory | |
| Fabricantes | Numonyx | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de JS28F256P30T95 (archivo pdf) en la parte inferior de esta página. Total 70 Páginas | ||
|
No Preview Available !
Numonyx™ StrataFlash® Embedded Memory
(P30)www.DataSheet4U.com
Product Features
Datasheet
High performance
Security
— 85 ns initial access
— One-Time Programmable Registers:
— 52 MHz with zero wait states, 17ns clock-to-data output
• 64 unique factory device identifier bits
synchronous-burst read mode
• 2112 user-programmable OTP bits
— 25 ns asynchronous-page read mode
— Selectable OTP Space in Main Array:
— 4-, 8-, 16-, and continuous-word burst mode
— Buffered Enhanced Factory Programming (BEFP) at 5 μs/
byte (Typ)
— 1.8 V buffered programming at 7 μs/byte (Typ)
• Four pre-defined 128-KByte blocks (top or bottom
configuration)
• Up to Full Array OTP Lockout
— Absolute write protection: VPP = VSS
Architecture
— Multi-Level Cell Technology: Highest Density at Lowest
Cost
— Power-transition erase/program lockout
— Individual zero-latency block locking
— Individual block lock-down
— Asymmetrically-blocked architecture
Software
— Four 32-KByte parameter blocks: top or bottom
— 20 μs (Typ) program suspend
configuration
— 20 μs (Typ) erase suspend
— 128-KByte main blocks
— Numonyx™ Flash Data Integrator optimized
Voltage and Power
— VCC (core) voltage: 1.7 V – 2.0 V
— VCCQ (I/O) voltage: 1.7 V – 3.6 V
— Standby current: 20μA (Typ) for 64-Mbit
— Basic Command Set and Extended Command Set
compatible
— Common Flash Interface capable
Density and Packaging
— 4-Word synchronous read current:
13 mA (Typ) at 40 MHz
— 56- Lead TSOP package (64, 128, 256,
512- Mbit)
Quality and Reliability
— Operating temperature: –40 °C to +85 °C
— Minimum 100,000 erase cycles per block
— ETOX™ VIII process technology
— 64- Ball Numonyx™ Easy BGA package (64,
128, 256, 512- Mbit)
— Numonyx™ QUAD+ SCSP (64, 128, 256,
512- Mbit)
— 16-bit wide data bus
Order Number: 306666-11
November 2007
1 page  
P30
Revision History
Revision Date
April 2005
August 2005
www.DataSheet4U.com
September 2005
November 2005
February 2006
April 2006
May 2006
May-2006
June - 2007
November 2007
November 2007
Revision
-001
-002
-003
-004
-005
-006
-007
-008
-009
-010
11
Description
Initial Release
Revised discrete memory maps in Section 4.4, “Memory Maps” on page 22
Added memory maps for 512-Mbit top parameter devices in Section 4.4, “Memory
Maps” on page 22
Fixed size of Programming Region for 256-Mbit to be 8-Mbit in Section 4.4, “Memory
Maps” on page 22 and Section 11.0, “Programming Operations” on page 56
Removed power supply sequencing requirement in Section 8.1, “Power-Up and Power-
Down” on page 41
Updated conditions for Table 15, “Capacitance” on page 29
Updated CFI table in Appendix C, “Common Flash Interface”
Added note to Table 34, “Device ID codes” on page 71 for stacked Device ID codes
Synchronous burst read operation is currently not supported for the TSOP package
Updated 512-Mbit Easy BGA Ball Height (symbol A1) in Figure 2, “Easy BGA Mechanical
Specifications” on page 11
Updated read access speed for 265M TSOP package
Removed all references to 1 Gigabit.
• Added 52 MHz capabilities,
• Added TSOP Package information for 512 Mb throughout the document,
• Added Section 2.1, “Virtual Chip Enable Description” on page 8,
• Modified figures in Section 4.3, “Dual-Die Configurations” on page 21,
• Modified Table 9, “512-Mbit Top and Bottom Parameter Memory Map (Easy BGA and
QUAD+ SCSP)” on page 23,
• Modified Notes 5 & 6 to Reset Specifications table in Section 8.2, “Reset
Specifications” on page 41,
• Added additional note on 512 Mb capability in Table 31, “Selectable OTP Block
Mapping” on page 66.
• Updated the following tables to 52 MHz: Table 16, “AC Read Specifications for 64/
128- Mbit Densities” on page 29 and Table 17, “AC Read Specifications for 256/512-Mbit
Densities” on page 30.
• Added notes 1, 2, and 3 to Table 15, “Capacitance” on page 29.
• Correct typos and add clarifications
• Enabled specific burst operation on TSOP packages.
• Updated device commands table.
• Updaed description on synchronous burst operation.
• Added EOWL description.
• Updated flowcharts
• Updated for 65nm lithography
• Added W602 - Erase to Suspend
• Applied Numonyx branding.
November 2007
Order Number: 306666-11
Datasheet
5
5 Page 
P30
Table 3: TSOP Package Dimensions (Sheet 2 of 2)
Product Information
Symbol
Min
Millimeters
Nom
Max
Min
Inches
Nom
Lead Tip Length
L
0.500
0.600
0.700
0.020
0.024
Lead Count
N - 56 - - 56
Lead Tip Angle
ý 0° 3° 5° 0° 3°
Seating Plane Coplanarity
Y
- - 0.100 - -
Lead to Package Offset
Z
0.150
0.250
0.350
0.006
0.010
Notes:
www.DataSheet4U.com1.
One dimple on package denotes Pin 1.
2. If two dimples, then the larger dimple denotes Pin 1.
3. Pin 1 will always be in the upper left corner of the package, in reference to the product mark.
4. Daisy Chain Evaluation Unit information is at Numonyx™ Flash Memory Packaging Technology
http://developer.Numonyx.com/design/flash/packtech.
Max
0.028
-
5°
0.004
0.014
3.2 64-Ball Easy BGA Package
Notes
Figure 2: Easy BGA Mechanical Specifications
Ball A1
Corner
D
Ball A1
Corner
S1
12 3 4 5 6 7 8
A
B
C
D
E
E
F
G
H
Top View - Ball side down
8
A
B
C
D
E
F
G
H
7 6 5 4 3 21
Bottom View - Ball Side Up
S2
b
e
A1
A2
A Seating
Plane
Y
Note: Drawing not to scale
November 2007
Order Number: 306666-11
Datasheet
11
11 Page | ||
| Páginas | Total 70 Páginas | |
| PDF Descargar | [ Datasheet JS28F256P30T95.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| JS28F256P30T95 | Embedded Memory | Numonyx |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |