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PDF GS8161E18B Data sheet ( Hoja de datos )

Número de pieza GS8161E18B
Descripción (GS8161E18B - GS8161E36B) Sync Burst SRAMs
Fabricantes GSI Technology 
Logotipo GSI Technology Logotipo



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No Preview Available ! GS8161E18B Hoja de datos, Descripción, Manual

GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
100-Pin TQFP & 165-Bump BGA 1M x 18, 512K x 36, 512K x 36
Commercial Temp
Industrial Temp
18Mb Sync Burst SRAMs
250 MHz150 MHz
2.5 V or 3.3 V VDD
2.5 V or 3.3 V I/O
Features
• FT pin for user-configurable flow through or pipeline operation
• Dual Cycle Deselect (DCD) operation
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
www.DataSheet4LUB.cOompin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
• Automatic power-down for portable applications
• JEDEC-standard 100-lead TQFP package
• RoHS-compliant 100-lead TQFP and 165-bump BGA packages
available
Functional Description
Applications
The GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
is a 18,874,368-bit high performance synchronous SRAM with
a 2-bit burst address counter. Although of a type originally
developed for Level 2 Cache applications supporting high
performance CPUs, the device now finds application in
synchronous SRAM applications, ranging from DSP main
store to networking chip set support.
Controls
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx,
BW, GW) are synchronous and are controlled by a positive-
edge-triggered clock input (CK). Output enable (G) and power
down control (ZZ) are asynchronous inputs. Burst cycles can
be initiated with either ADSP or ADSC inputs. In Burst mode,
subsequent burst addresses are generated internally and are
controlled by ADV. The burst address counter may be
configured to count in either linear or interleave order with the
Linear Burst Order (LBO) input. The Burst function need not
be used. New addresses can be loaded on every cycle with no
degradation of chip performance.
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode
pin low places the RAM in Flow Through mode, causing
output data to bypass the Data Output Register. Holding FT
high places the RAM in Pipeline mode, activating the rising-
edge-triggered Data Output Register.
DCD Pipelined Reads
The GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
is a DCD (Dual Cycle Deselect) pipelined synchronous
SRAM. SCD (Single Cycle Deselect) versions are also
available. DCD SRAMs pipeline disable commands to the
same degree as read commands. DCD RAMs hold the deselect
command for one full cycle and then begin turning off their
outputs just after the second rising edge of clock.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Sleep Mode
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Core and Interface Voltages
The GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V
and 2.5 V compatible. Separate output power (VDDQ) pins are
used to decouple output noise from the internal circuits and are
3.3 V and 2.5 V compatible.
Parameter Synopsis
-250 -200 -150 Unit
Pipeline
3-1-1-1
Flow Through
2-1-1-1
tKQ
tCycle
Curr (x18)
Curr (x32/x36)
tKQ
tCycle
Curr (x18)
Curr (x32/x36)
2.5 3.0 3.8 ns
4.0 5.0 6.7 ns
295 245 200 mA
345 285 225 mA
5.5 6.5 7.5 ns
5.5 6.5 7.5 ns
225 200 185 mA
255 220 205 mA
Rev: 1.03 9/2005
1/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology

1 page




GS8161E18B pdf
A
B
C
www.DataSheet4U.com D
E
F
G
H
J
K
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GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
165 Bump BGA—x18 Commom I/O—Top View (Package D)
1 2 3 4 5 6 7 8 9 10 11
NC A E1 BB NC E3 BW ADSC ADV A
A
NC A E2 NC BA CK GW G ADSP A NC
NC NC VDDQ VSS VSS VSS VSS VSS VDDQ NC DQPA
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
NC DQB VDDQ VDD VSS VSS VSS VDD VDDQ NC DQA
FT MCL NC VDD VSS VSS VSS VDD NC NC ZZ
DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
DQB NC VDDQ VDD VSS VSS VSS VDD VDDQ DQA NC
DQPB NC VDDQ VSS
NC
A
NC VSS VDDQ NC NC
NC NC
A
A TDI A1 TDO A
A
A
A
LBO NC
A
A TMS A0 TCK A
A
A
A
11 x 15 Bump BGA—13mm x 15 mm Body—1.0 mm Bump Pitch
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
Rev: 1.03 9/2005
5/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology

5 Page





GS8161E18B arduino
GS8161E18B(T/D)/GS8161E32B(D)/GS8161E36B(T/D)
Byte Write Truth Table
Function GW BW BA BB BC BD Notes
Read
HHX X X X 1
Read
HLHHHH1
Write byte a
H
L
L
H
H
H 2, 3
Write byte b
H
L
H
L
H
H 2, 3
www.DataSheet4U.cWomrite byte c
H
L
H
H
L
H 2, 3, 4
Write byte d
H
L
H
H
H
L 2, 3, 4
Write all bytes
H
L
L
L
L
L 2, 3, 4
Write all bytes
L
X
X
X
X
X
Notes:
1. All byte outputs are active in read cycles regardless of the state of Byte Write Enable inputs.
2. Byte Write Enable inputs BA, BB, BC and/or BD may be used in any combination with BW to write single or multiple bytes.
3. All byte I/Os remain High-Z during all write operations regardless of the state of Byte Write Enable inputs.
4. Bytes “C” and “D” are only available on the x36 version.
Rev: 1.03 9/2005
11/35
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
© 2004, GSI Technology

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