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PDF W3DG6434V-D2 Data sheet ( Hoja de datos )

Número de pieza W3DG6434V-D2
Descripción SDRAM UNBUFFERED
Fabricantes White Electronic Designs 
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No Preview Available ! W3DG6434V-D2 Hoja de datos, Descripción, Manual

White Electronic Designs
W3DG6434V-D2
256MB – 2x16Mx64 SDRAM UNBUFFERED
FEATURES
PC100 and PC133 compatible
Burst Mode Operation
Auto and Self Refresh capability
LVTTL compatible inputs and outputs
Serial Presence Detect with EEPROM
Fully synchronous: All signals are registered on the positive
edge of the system clock
Programmable Burst Lengths: 1, 2, 4, 8 or Full Page
3.3V ± 0.3V Power Supply
168 pin DIMM JEDEC
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DESCRIPTION
The W3DG6434V is a 2x16Mx64 synchronous DRAM
module which consists of sixteen 16Mx8 SDRAM
components in TSOP II package and one 2K EEPROM
in an 8 pin TSSOP package for Serial Presence Detect
which are mounted on a 168 pin DIMM multilayer FR4
Substrate.
* This product is subject to change without notice.
NOTE: Consult factory for availability of:
• Lead-Free or RoHS Products
• Vendor source control options
• Industrial temperature option
PIN CONFIGURATIONS (FRONT SIDE/BACK SIDE)
PIN FRONT PIN FRONT PIN FRONT PIN BACK PIN BACK PIN BACK
1 VSS 29 DQM1 57 DQ18 85 VSS 113 DQM5 141 DQ50
2 DQ0 30 CS0# 58 DQ19 86 DQ32 114 CS1# 142 DQ51
3 DQ1 31 DNU 59 VCC 87 DQ33 115 RAS# 143 VCC
4 DQ2 32 VSS 60 DQ20 88 DQ34 116 VSS 144 DQ52
5 DQ3 33 A0 61 NC 89 DQ35 117 A1 145 NC
6
VCC 34
A2
62 *VREF 90
VCC
118
A3 146 *VREF
7 DQ4 35 A4 63 CKE1 91 DQ36 119 A5 147 DNU
8 DQ5 36 A6 64 VSS 92 DQ37 120 A7 148 VSS
9 DQ6 37 A8 65 DQ21 93 DQ38 121 A9 149 DQ53
10 DQ7 38 A10/AP 66 DQ22 94 DQ39 122 BA0 150 DQ54
11 DQ8 39 BA1 67 DQ23 95 DQ40 123 A11 151 DQ55
12 VSS 40 VCC 68 VSS 96 VSS 124 VCC 152 VSS
13 DQ9 41 VCC 69 DQ24 97 DQ41 125 CK1 153 DQ56
14 DQ10 42 CK0 70 DQ25 98 DQ42 126 *A12 154 DQ57
15 DQ11 43 VSS 71 DQ26 99 DQ43 127 VSS 155 DQ58
16 DQ12 44 DNU 72 DQ27 100 DQ44 128 CKE0 156 DQ59
17 DQ13 45 CS2# 73
VCC 101 DQ45 129 CS3# 157 VCC
18 VCC 46 DQM2 74 DQ28 102 VCC 130 DQM6 158 DQ60
19 DQ14 47 DQM3 75 DQ29 103 DQ46 131 DQM7 159 DQ61
20 DQ15 48 DNU 76 DQ30 104 DQ47 132 *A13 160 DQ62
21 *CB0 49 VCC 77 DQ31 105 *CB4 133 VCC 161 DQ63
22 *CB1 50 NC 78 VSS 106 *CB5 134 NC 162 VSS
23 VSS 51 NC 79 CK2 107 VSS 135 NC 163 CK3
24 NC 52 *CB2 80 NC 108 NC 136 *CB6 164 NC
25 NC 53 *CB3 81 WP*** 109 NC 137 *CB7 165 **SA0
26 VCC 54 VSS 82 **SDA 110 VCC 138 VSS 166 **SA1
27 WE# 55 DQ16 83 **SCL 111 CAS# 139 DQ48 167 **SA2
28 DQM0 56 DQ17 84
VCC 112 DQM4 140 DQ49 168 VCC
PIN NAMES
A0 – A11
BA0-1
DQ0-63
CK0-CK3
CKE0,CKE1
CS0#-CS3#
RAS#
CAS#
WE#
DQM0-7#
VCC
VSS
SDA
SCL
DNU
NC
WP
Address input (Multiplexed)
Select Bank
Data Input/Output
Clock input
Clock Enable input
Chip select Input
Row Address Strobe
Column Address Strobe
Write Enable
DQM
Power Supply (3.3V)
Ground
Serial data I/O
Serial clock
Do not use
No Connect
Write Protect
* These pins are not used in this module.
** These pins should be NC in the system
which does not support SPD.
*** WP available on the W3DG6334V-D2.
July 2004
Rev 1
1 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

1 page




W3DG6434V-D2 pdf
White Electronic Designs
W3DG6434V-D2
ORDERING INFORMATION
Part Number
Speed CAS Latency Height*
Part Number
Speed CAS Latency Height*
W3DG6434V10D2
100MHz
CL=2 30.48 (1.20")
W3DG6334V10D2
100MHz
CL=2 30.48 (1.20")
W3DG6434V7D2
133MHz
CL=2 30.48 (1.20")
W3DG6334V7D2
133MHz
CL=2 30.48 (1.20")
W3DG6434V75D2
133MHz
CL=3 30.48 (1.20")
W3DG6334V75D2
133MHz
CL=3 30.48 (1.20")
Note: Available with "WP" Write Protect on pin 81.
NOTES:
• Consult Factory for availability of Lead-Free or RoHS products. (F = Lead-Free, G = RoHS Compliant)
• Vendor specific part numbers are used to provide memory components source control. The place holder for this is shown as lower case “x” in the part numbers above and is to
be replaced with the respective vendors code. Consult factory for qualified sourcing options. (M = Micron, S = Samsung & consult factory for others)
• Consult factory for availability of industrial temperature (-40°C to 85°C) option
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3.99
(0.157)
(2X)
3.18
(0.125) (2X)
PACKAGE DIMENSIONS
133.48
(5.255 MAX.)
8.89
(0.350)
P1
11.43
(0.450)
36.83
(1.450)
6.35
(0.250)
42.16
(1.660)
115.57
(4.550)
6.35
(0.250)
54.61
(2.150)
3.81
(0.150)
MAX.
30.48
(1.200)
17.78 MAX.
(0.700)
3.99
(0.157 MIN.)
1.27
(0.050 ± 0.004)
ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
July 2004
Rev 1
5 White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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