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PDF 109P-1-A-x Data sheet ( Hoja de datos )
| Número de pieza | 109P-1-A-x | |
| Descripción | Micro SIL Reed Relays | |
| Fabricantes | Pickering | |
| Logotipo |  |
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SERIES 109
PICKERING SERIES 109
Micro-SIL® reed relays
Including coaxial types
for stacking on 0.15 x 0.6 inches pitch
giving SUPERB PACKING DENSITY
pickering
Pickering Electronics Limited
Stephenson Road
Clacton-on-Sea
CO15 4NL
England
Telephone (UK) 01255 428141
(International) +44 1255 428141
Fax. (UK)
01255 475058
(International) +44 1255 475058
www.DataSheet4U.com
The mu-metal packaged Series 109 and 109RF and the plastic
packaged Series 109P and Series 109PH, are magnetically
screened single-in-line reed relays that stack on 0.15 inches x
0.6 inches pitch. The adjacent column gives further details of
the device types available.
These relays require little more than half the board area of the
more usual 0.2 x 0.8 inch devices, this allows around 80
percent more relays onto your board. These are the ideal
choice for high density applications such as A.T.E. switching
matrices or where very little board area is available.
Mu-metal, due to its high permeability and low magnetic
remanance is used to provide magnetic screening. This
eliminates problems that would otherwise occur due to
magnetic interaction. Interaction is usually measured as a
percentage increase in the voltage required to operate a relay
when two additional relays, stacked one each side, are
themselves operated. An unscreened device mounted on this
pitch would have an interaction figure of around 40 percent.
Relays of this size without magnetic screening would therefore
be totally unsuitable for applications where dense packing is
required. Pickering Series 109 and 109RF have a typical
interaction figure of 1 percent. Series 109P and 109PH have
a typical figure of 3 percent.
Two types of Form A (energize to make) switches are
available, a general purpose switch (switch no.1) and a
vacuum sputtered ruthenium switch (switch no.2) which is
ideal for low level or “cold” switching applications.
5 volt coils normally have a resistance of 500 ohms and 12
volt coils are 1000 ohms. A sensitive single pole 5 volt device
with a 1000 ohms coil is also available. Internal back E.M.F.
clamping diodes are an option for all types. The small size of
these relays often makes it possible to increase the
functionality of existing designs without increasing the size of
printed circuit boards.
Configurations available
1 Form A
(energise to make)
1 Form A Coaxial
50 Ohms impedance
2 Form A
(energise to make)
(energise to make)
1 Form B
1 Form A Coaxial
75 Ohms impedance
(energise to break)
(energise to make)
Insulation resistance greater than 1012 ohms.
5 and 12 Volt coils are standard, with or without
internal diode.
Top (Left to right): 109P, 109-1-A, 109-2-A
Bottom: 109-1-B, 109RF Coaxial, 109PH
Description of Device Types
See reverse side of data sheet for dimensional details.
Series 109 1 Form A, 2 Form A, 1 Form B.
Similar in construction to the Pickering Series 107 and Series
108. These patented devices are encapsulated in mu-metal
cans using very high resistivity resins.
Series 109RF
Coaxial 1 Form A.
Coaxial relays in mu-metal cans. They are available with a
characteristic impedance of either 50 or 75 ohms. For R.F. up
to 2GHz, telecoms, video or high speed digital switching up to
500 Mbits/sec. Contact technical sales office for further data.
Series 109P
1 Form A.
The electrical specification and dimensions are identical to the
1 Form A Series 109. They are encapsulated using the same
resins within a plastic package which features an internal mu-
metal magnetic screen.
Series 109PH
1 Form A.
The electrical specification is again identical but the mu-metal
screened plastic package is slightly different having an
increased stand-off from the printed circuit board. Small feet
on each corner of this relay lift the underside of the
component 0.05 inches (1.25mm) from the board surface
rather than the more usual 0.02 inches (0.5mm). These
components are often used in large blocks with little or no
clearance between them, for example in an ATE matrix. Flux
residues can degrade insulation resistance values, the
increased clearance is useful to facilitate easier cleaning after
flow soldering. The move away from CFC cleaning solvents
makes this feature particularly attractive when using less
aggressive solvents or aqueous washing.
109/P15
1 page | ||
| Páginas | Total 2 Páginas | |
| PDF Descargar | [ Datasheet 109P-1-A-x.PDF ] | |
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