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Número de pieza | HV895 | |
Descripción | Liquid Lens Driver | |
Fabricantes | Supertex | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de HV895 (archivo pdf) en la parte inferior de esta página. Total 5 Páginas | ||
No Preview Available ! HV895
Liquid Lens Driver
Features
► Drives capacitive loads up to 200pF
► Programmable drive amplitude (up to 60VRMS)
► On-chip boost converter
► No external inductor
www.Data►SheeIt24CU.icnotmerface
► Low operating current (≤20mA)
► Low standby current (≤1.0µA)
► Controlled drive edge reduces EMI
► 1.0mm × 6.0mm flip-chip
Applications
► Cell phone and PDA cameras
► Bar code readers
► Web and laptop cameras
► Biometric scanners
► Ultracompact cameras
Typical Application Circuit
I2C bus
General Description
The HV895 is designed to drive liquid lenses of up to 200pF with
a 1.5kHz waveform at amplitudes up to 60VRMS, controlled via an
I2C interface.
A single byte (AMP) written to the HV895 controls the operation of
the driver. Setting AMP = 01h to FFh controls output amplitude in
255 monotonic steps. Setting AMP = 00h causes the HV895 to go
into low power standby mode, consuming less than 1.0µA. When
active, the HV895 draws less than 20mA.
A charge pump boost converter integrated on-chip provides the
high voltage necessary for driving the lens. No external inductors
or diodes are needed. Two ceramic 0402 size capacitors are the
only external components required for a complete lens driver
circuit. The narrow die size and only 2 small external components
allow an entire lens driver circuit to be incorporated inside a
camera module.
An H-bridge output stage provides AC drive to the lens, allowing
the use of a single high voltage boost converter while providing
alternating polarity to the lens. Controlled rising and falling edges
on the drive waveform reduces EMI.
The HV895 is offered in a 1.0mm × 6.0mm lead-free solder-
bumped flip-chip.
VDD
1.7 -2.95V
VIN
2.65 - 5.5V
CIN
2.2μF
6.3V
VDD
SDA
SCL
VIN1
VIN2
HV895
OUT1
OUT2
HV GND1 GND2
CHV
4.7nF
100V
Liquid Lens
100 -200pF
1 page Die Dimensions
1000–+705
DUM1
GND1
DUM2
VIN1
500 ±25
HV895
www.DataSheet4U.com
6000
+0
–196
VDD
SDA
GND2
SCL
VIN2
OUT2
0
442.8
HV
OUT1
124–137
Y
X
Note:
All dimensions in µm
143.3
Orientation mark
0 this end, top side
Bottom View
100 ±25
Side View
Bump Coordinates and Descriptions (XY coordinates reference center of bump and are in µm. Tolerance is ±15µm.)
Bump
X
Y Description
VIN1
VIN2
353.4 5201.7 VIN1 supplies the DC-DC converter. VIN2 supplies the rest of the IC. They must be tied together. To
675.4 2424.6 minimize conducted EMI, bypass with a 2.2µF ceramic capacitor to ground close to the IC.
VDD 12.7 2891.0 Externally supplied reference voltage for the I2C logic levels. Connect to the I2C bus supply.
GND1 353.4 4397.6 GND1 is the ground for the for the DC-DC converter, while GND2 is for the rest of the IC. Connect both
GND2 -14.8 1844.0 to system ground.
SCL
SDA
12.7
12.7
1594.0
2171.2
Serial clock for the I2C interface. The HV895 is a Fast Mode device (fSCL ≤ 400kHz).
Serial data for the I2C interface. The HV895 is a write-only device, with a single 8-bit command byte
(AMP, see page 4).
HV
722.4
1006.6
High voltage DC output of the internal boost converter. Connect a 4.7nF, 100V ceramic capacitor to
ground close to the IC.
OUT1 666.3
OUT2
0
0.0 Outputs of the H-bridge driver. The liquid lens connects between these two bumps. When disabled
0 (AMP = 00h), both of these outputs are held at ground.
DUM1 3.9 5334.2 These bumps are for mechanical support only. Provide pads on the PCB for these solder bumps. No
DUM2 702.9 5334.2 electrical connections should be made to these bumps.
Doc.# DSFP-HV895
NR031408
5
5 Page |
Páginas | Total 5 Páginas | |
PDF Descargar | [ Datasheet HV895.PDF ] |
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