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PDF 10H158 Data sheet ( Hoja de datos )
| Número de pieza | 10H158 | |
| Descripción | MC10H158 | |
| Fabricantes | ON Semiconductor | |
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MC10H158
Quad 2−Input Multiplexer
(Non−Inverting)
Description
The MC10H158 is a quad two channel multiplexer with common
input select. A “high” level select enables input D00, D10, D20 and
D30 and a “low” level select enables input D01, D11, D21 and D31.
This MECL 10H™ part is a functional/pinout duplication of the
standard MECL 10K™ family part, with 100% improvement in
www.DataSheetp4rUo.pcaogmation delay and no increase in power−supply current.
Features
• Propagation Delay, 1.5 ns Typical
• Power Dissipation, 197 mW Typical
• Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
• Voltage Compensated
• MECL 10K Compatible
• Pb−Free Packages are Available*
TRUTH TABLE
Select
L
L
H
H
D0
X
X
L
H
D1
L
H
X
X
Q
L
H
L
H
DIP
PIN ASSIGNMENT
Q0 1
Q1 2
D11 3
D10 4
D01 5
D00 6
NC 7
VEE 8
16 VCC
15 Q2
14 Q3
13 D20
12 D21
11 D30
10 D31
9 SELECT
Pin assignment is for Dual−in−Line Package.
For PLCC pin assignment, see the Pin Conversion Tables on page 18
of the ON Semiconductor MECL Data Book (DL122/D).
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
1
http://onsemi.com
MARKING DIAGRAMS*
CDIP−16
L SUFFIX
CASE 620A
16
MC10H158L
AWLYYWW
1
16
16
1
PDIP−16
P SUFFIX
CASE 648
MC10H158P
AWLYYWWG
1
10H158
ALYWG
SOEIAJ−16
CASE 966
1 20
20 1
PLLC−20
FN SUFFIX
CASE 775
10H158G
AWLYYWW
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G = Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Publication Order Number:
MC10H158/D
1 page  
16
1
www.DataSheet4U.com
e
Z
D
b
0.13 (0.005) M
B
16
B
1
C
K
N
MC10H158
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
9
E HE
8
LE
M_
Q1
L
DETAIL P
VIEW P
A
c
A1
0.10 (0.004)
A
E
F
CDIP−16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A−01
ISSUE O
A
9
L
8
M
16X J
0.25 (0.010) M T B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A −−− 2.05 −−− 0.081
A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.10 0.20 0.007 0.011
D 9.90 10.50 0.390 0.413
E 5.10 5.45 0.201 0.215
e 1.27 BSC
0.050 BSC
HE 7.40 8.20 0.291 0.323
L 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M 0 _ 10 _ 0 _ 10 _
Q1 0.70 0.90 0.028 0.035
Z −−− 0.78 −−− 0.031
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5 THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 620−10.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.750 0.785 19.05 19.93
B 0.240 0.295 6.10 7.49
C −−− 0.200 −−− 5.08
D 0.015 0.020 0.39 0.50
E 0.050 BSC
1.27 BSC
F 0.055 0.065 1.40 1.65
G 0.100 BSC
2.54 BSC
H 0.008 0.015 0.21 0.38
K 0.125 0.170 3.18 4.31
L 0.300 BSC
7.62 BSC
M 0_ 15_ 0_ 15_
N 0.020 0.040 0.51 1.01
T
SEATING
PLANE
G
16X D
0.25 (0.010) M T A
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