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What is LM2435T?

This electronic component, produced by the manufacturer "National Semiconductor", performs the same function as "Monolithic Triple 5.5 ns CRT Driver".


LM2435T Datasheet PDF - National Semiconductor

Part Number LM2435T
Description Monolithic Triple 5.5 ns CRT Driver
Manufacturers National Semiconductor 
Logo National Semiconductor Logo 


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August 1999
LM2435
Monolithic Triple 5.5 ns CRT Driver
General Description
The LM2435 is an integrated high voltage CRT driver circuit
designed for use in color monitor applications. The IC con-
tains three high input impedance, wide band amplifiers
which directly drive the RGB cathodes of a CRT. Each chan-
nel has its gain internally set to −14 and can drive CRT ca-
pacitive loads as well as resistive loads present in other ap-
plications, limited only by the package’s power dissipation.
The IC is packaged in an industry standard 9-lead TO-220
molded plastic power package. See Thermal Considerations
section.
Features
n Dissipates approximately 45% less power than the
LM2405
n Well matched with LM1279 and LM1282/83 video
preamps
n 0V to 5V input range
n Stable with 0 pF–20 pF capacitive loads and inductive
peaking networks
n Convenient TO-220 staggered lead package style
n Standard LM243X Family Pinout which is designed for
easy PCB layout
Applications
n 1280 x 1024 Displays up to 75 Hz Refresh
n Pixel clock frequencies up to 135 MHz
n Monitors using video blanking
Schematic and Connection Diagrams
DS101044-1
FIGURE 1. Simplified Schematic Diagram
(One Channel)
DS101044-2
Note: Tab is at GND
Top View
Order Number LM2435T
© 1999 National Semiconductor Corporation DS101044
www.national.com

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LM2435T equivalent
Application Hints (Continued)
DS101044-10
FIGURE 9. One Channel of the LM2435 with the Recommended Application Circuit
OPTIMIZING TRANSIENT RESPONSE
Referring to Figure 9, there are three components (R1, R2
and L1) that can be adjusted to optimize the transient re-
sponse of the application circuit. Increasing the values of R1
and R2 will slow the circuit down while decreasing over-
shoot. Increasing the value of L1 will speed up the circuit as
well as increase overshoot. It is very important to use induc-
tors with very high self-resonant frequencies, preferably
above 300 MHz. Ferrite core inductors from J.W. Miller Mag-
netics (part # 78FR22K) were used for optimizing the perfor-
mance of the device in the NSC application board. The val-
ues shown in Figure 9 can be used as a good starting point
for the evaluation of the LM2435. Using a variable resistor
for R1 will simplify finding the value needed for optimum per-
formance in a given application. Once the optimum values
are determined the variable resistor can be replaced with
fixed values.
EFFECT OF LOAD CAPACITANCE
Figure 8 shows the effect of increased load capacitance on
the speed of the device. This demonstrates the importance
of knowing the load capacitance in the application.
cation. The designer should note that if the load capacitance
is increased the AC component of the total power dissipation
will also increase.
The LM2435 case temperature must be maintained below
100˚C. If the maximum expected ambient temperature is
70˚C and the maximum power dissipation is 8.7W (from Fig-
ure 6, 72.5 MHz bandwidth) then a maximum heat sink ther-
mal resistance can be calculated:
This example assumes a capacitive load of 8 pF and no re-
sistive load.
TYPICAL APPLICATION
A typical application of the LM2435 is shown in Figure 10.
Used in conjunction with an LM1279, a complete video chan-
nel from monitor input to CRT cathode can be achieved. Per-
formance is ideal for 1280 x 1024 resolution displays with
pixel clock frequencies up to 135 MHz. Figure 10 is the sche-
matic for the NSC demonstration board that can be used to
evaluate the LM1279/2435 combination in a monitor.
EFFECT OF OFFSET
Figure 7 shows the variation in rise and fall times when the
output offset of the device is varied from 40 VDC to 50 VDC.
The rise time shows a maximum variation relative to the cen-
ter data point (45 VDC) of about 13%. The fall time shows a
maximum variation of about 3% relative to the center data
point.
THERMAL CONSIDERATIONS
Figure 4 shows the performance of the LM2435 in the test
circuit shown in Figure 2 as a function of case temperature.
The figure shows that the rise time of the LM2435 increases
by approximately 12% as the case temperature increases
from 50˚C to 100˚C. This corresponds to a speed degrada-
tion of 2.4% for every 10˚C rise in case temperature. There
is a negligible change in fall time vs. temperature in the test
circuit.
Figure 6 shows the maximum power dissipation of the
LM2435 vs Frequency when all three channels of the device
are driving an 8 pF load with a 40 Vp-p alternating one pixel
on, one pixel off signal. The graph assumes a 72% active
time (device operating at the specified frequency) which is
typical in a monitor application. The other 28% of the time
the device is assumed to be sitting at the black level (65V in
this case). This graph gives the designer the information
needed to determine the heat sink requirement for the appli-
PC BOARD LAYOUT CONSIDERATIONS
For optimum performance, an adequate ground plane, isola-
tion between channels, good supply bypassing and minimiz-
ing unwanted feedback are necessary. Also, the length of the
signal traces from the preamplifier to the LM2435 and from
the LM2435 to the CRT cathode should be as short as pos-
sible. The following references are recommended:
Ott, Henry W., “Noise Reduction Techniques in Electronic
Systems”, John Wiley & Sons, New York, 1976.
“Video Amplifier Design for Computer Monitors”, National
Semiconductor Application Note 1013.
Pease, Robert A., “Troubleshooting Analog Circuits”,
Butterworth-Heinemann, 1991.
Because of its high small signal bandwidth, the part may os-
cillate in a monitor if feedback occurs around the video chan-
nel through the chassis wiring. To prevent this, leads to the
video amplifier input circuit should be shielded, and input cir-
cuit wiring should be spaced as far as possible from output
circuit wiring.
It is very important that the tab of the heatsink is connected
to PCB ground. The single ground pin does not provide an
adequate return path at high frequencies. The ground con-
nection can be made using the heatsink. The NSC LM1279
& LM243X (Nov. 1998, Rev. B) demo board, shown in Figure
11 and Figure 12, provides a good example of how this can
be done. A Thermalloy 6698B heatsink is used in the demo
5 www.national.com


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