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PDF HYM71V16655HCT6 Data sheet ( Hoja de datos )

Número de pieza HYM71V16655HCT6
Descripción PC100 SDRAM Unbuffered DIMM
Fabricantes Hynix Semiconductor 
Logotipo Hynix Semiconductor Logotipo



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16Mx64 bits
PC100 SDRAM Unbuffered DIMM
based on 8Mx16 SDRAM with LVTTL, 4 banks & 4K Refresh
HYM71V16655HCT6 Series
DESCRIPTION
The Hynix HYM71V16655HCT6 Series are 16Mx64bits Synchronous DRAM Modules. The modules are composed of eight 8Mx16bits
CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, one 2Kbit EEPROM in 8pin TSSOP package on a 168pin glass-epoxy
printed circuit board. Two 0.33uF and one 0.1uF decoupling capacitors per each SDRAM are mounted on the PCB.
The Hynix HYM71V16655HCT6 Series are Dual In-line Memory Modules suitable for easy interchange and addition of 128Mbytes
memory. The Hynix HYM71V16655HCT6 Series are fully synchronous operation referenced to the positive edge of the clock . All
inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high
bandwidth.
FEATURES
• PC100MHz support
• SDRAM internal banks : four banks
• 168pin SDRAM Unbuffered DIMM
• Module bank : two physical bank
• Serial Presence Detect with EEPROM
• Auto refresh and self refresh
• 1.25” (31.75mm) Height PCB with double sided com- • 4096 refresh cycles / 64ms
ponents
• Programmable Burst Length and Burst Type
• Single 3.3±0.3V power supply
- 1, 2, 4 or 8 or Full page for Sequential Burst
• All device pins are compatible with LVTTL interface
- 1, 2, 4 or 8 for Interleave Burst
• Data mask function by DQM
• Programmable CAS Latency ; 2, 3 Clocks
ORDERING INFORMATION
Part No.
HYM71V16M655HCT6-8
HYM71V16M655HCT6-P
HYM71V16M655HCT6-S
HYM71V16M655HCLT6-8
HYM71V16M655HCLT6-P
HYM71V16M655HCLT6-S
Clock
Frequency
125MHz
100MHz
100MHz
125MHz
100MHz
100MHz
Internal
Bank
4 Banks
Ref.
4K
Power
SDRAM
Package
Plating
Normal
Low Power
TSOP-II
Gold
This document is a general product description and is subject to change without notice. Hynix Semiconductor Inc. does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev. 0.5 / Mar. 2003
2

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SERIAL PRESENCE DETECT
PC100 SDRAM Unbuffered DIMM
HYM71V16655HCT6 Series
BYTE
NUMBER
BYTE0
BYTE1
BYTE2
BYTE3
BYTE4
BYTE5
BYTE6
BYTE7
BYTE8
BYTE9
BYTE10
BYTE11
BYTE12
BYTE13
BYTE14
BYTE15
BYTE16
BYTE17
BYTE18
BYTE19
BYTE20
BYTE21
BYTE22
BYTE23
BYTE24
BYTE25
BYTE26
BYTE27
BYTE28
BYTE29
BYTE30
BYTE31
BYTE32
BYTE33
BYTE34
BYTE35
BYTE36
~61
BYTE62
BYTE63
BYTE64
BYTE65
~71
BYTE72
FUNCTION
DESCRIPTION
# of Bytes Written into Serial Memory at Module
Manufacturer
Total # of Bytes of SPD Memory Device
Fundamental Memory Type
# of Row Addresses on This Assembly
# of Column Addresses on This Assembly
# of Module Banks on This Assembly
Data Width of This Assembly
Data Width of This Assembly (Continued)
Voltage Interface Standard of This Assembly
SDRAM Cycle Time @/CAS Latency=3
Access Time from Clock @/CAS Latency=3
DIMM Configuration Type
Refresh Rate/Type
Primary SDRAM Width
Error Checking SDRAM Width
Minimum Clock Delay Back to Back Random Column
Address
Burst Lenth Supported
# of Banks on Each SDRAM Device
SDRAM Device Attributes, /CAS Lataency
SDRAM Device Attributes, /CS Lataency
SDRAM Device Attributes, /WE Lataency
SDRAM Module Attributes
SDRAM Device Attributes, General
SDRAM Cycle Time @/CAS Latency=2
Access Time from Clock @/CAS Latency=2
SDRAM Cycle Time @/CAS Latency=1
Access Time from Clock @/CAS Latency=1
Minimum Row Precharge Time (tRP)
Minimum Row Active to Row Active Delay (tRRD)
Minimum /RAS to /CAS Delay (tRCD)
Minimum /RAS Pulse Width (tRAS)
Module Bank Density
Command and Address Signal Input Setup Time
Command and Address Signal Input Hold Time
Data Signal Input Setup Time
Data Signal Input Hold Time
Superset Information (may be used in future)
SPD Revision
Checksum for Byte 0~62
Manufacturer JEDEC ID Code
....Manufacturer JEDEC ID Code
Manufacturing Location
FUNCTION
-8 -P -S
128 Bytes
256 Bytes
SDRAM
12
9
2 Bank
64 Bits
-
LVTTL
8ns
10ns
10ns
6ns 6ns 6ns
None
15.625us
/ Self Refresh Supported
x16
None
tCCD = 1 CLK
1,2,4,8,Full Page
4 Banks
/CAS Latency=2,3
/CS Latency=0
/WE Latency=0
Neither Buffered nor Registered
+/- 10% voltage tolerence, Burst Read
Single Bit Write, Precharge All, Auto
Precharge, Early RAS Precharge
8ns
10ns
12ns
6ns 6ns 6ns
---
---
20ns
20ns
20ns
16ns
20ns
20ns
20ns
20ns
20ns
48ns
50ns
50ns
64MB
2ns 2ns 2ns
1ns 1ns 1ns
2ns 2ns 2ns
1ns 1ns 1ns
-
Intel SPD 1.2B
-
Hynix JEDED ID
Unused
HSI (Korea Area)
HSA (United States Area)
HSE (Europe Area)
HSJ (Japan Area)
HSS(Singapore)
Asia Area
-8
80h
60h
A0h
60h
00h
00h
14h
10h
14h
30h
20h
10h
20h
10h
E8h
VALUE
-P
80h
08h
04h
0Ch
09h
02h
40h
00h
01h
A0h
60h
00h
80h
10h
00h
01h
8Fh
04h
06h
01h
01h
00h
0Eh
A0h
60h
00h
00h
14h
14h
14h
32h
10h
20h
10h
20h
10h
00h
12h
0Eh
ADh
FFh
0*h
1*h
2*h
3*h
4*h
5*h
-S
A0h
60h
C0h
60h
00h
00h
14h
14h
14h
32h
20h
10h
20h
10h
2Eh
NOTE
1
2
3, 8
10
Rev. 0.5 / Mar. 2003
6

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AC CHARACTERISTICS II
PC100 SDRAM Unbuffered DIMM
HYM71V16655HCT6 Series
Parameter
Symbol
-8
Min Max
-P
Min Max
-S
Min Max
Unit Note
Operation tRC 68 - 70 - 70 - ns
RAS Cycle Time
Auto Refresh
tRRC
68
-
70
-
70
-
ns
RAS to CAS Delay
tRCD 20 - 20 - 20 - ns
RAS Active Time
tRAS
48 100K 50 100K 50 100K ns
RAS Precharge Time
tRP 20 - 20 - 20 - ns
RAS to RAS Bank Active Delay tRRD 16 - 20 - 20 - ns
CAS to CAS Delay
tCCD 1 - 1 - 1 - CLK
Write Command to Data-In Delay
tWTL
0
-
0
-
0
- CLK
Data-In to Precharge Command
tDPL
1 - 1 - 1 - CLK
Data-In to Active Command
tDAL
4 - 3 - 3 - CLK
DQM to Data-Out Hi-Z
tDQZ 2 - 2 - 2 - CLK
DQM to Data-In Mask
tDQM
0
-
0
-
0
- CLK
MRS to New Command
tMRD 2 - 2 - 2 - CLK
Precharge to Data CAS Latency = 3 tPROZ3
3
-
3
-
3
- CLK
Output Hi-Z
CAS Latency = 2 tPROZ2
2
-
2
-
2
- CLK
Power Down Exit Time
tPDE 1 - 1 - 1 - CLK
Self Refresh Exit Time
tSRE 1 - 1 - 1 - CLK 1
Refresh Time
tREF
- 64 - 64 - 64 ms
Note :
1. A new command can be given tRRC after self refresh exit
Rev. 0.5 / Mar. 2003
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