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PDF HYM71V16635BT8 Data sheet ( Hoja de datos )

Número de pieza HYM71V16635BT8
Descripción PC133 SDRAM Unbuffered DIMM
Fabricantes Hynix Semiconductor 
Logotipo Hynix Semiconductor Logotipo



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DESCRIPTION
16Mx64bits
PC133 SDRAM Unbuffered DIMM
based on 16Mx8 SDRAM with LVTTL, 4 banks & 4K Refresh
HYM71V16635BT8 Series
Preliminary
The Hynix HYM71V16635BT8 Series are 16Mx64bits Synchronous DRAM Modules. The modules are composed of eight 16Mx8bits
CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, one 2Kbit EEPROM in 8pin TSSOP package on a 168pin glass-epoxy
printed circuit board. One 0.22uF and one 0.0022uF decoupling capacitors per each SDRAM are mounted on the PCB.
The Hynix HYM71V16635BT8 Series are Dual In-line Memory Modules suitable for easy interchange and addition of 128Mbytes
memory. The Hynix HYM71V16635BT8 Series are fully synchronous operation referenced to the positive edge of the clock . All inputs
and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high band-
width.
FEATURES
• PC133/PC100MHz support
• 168pin SDRAM Unbuffered DIMM
• Serial Presence Detect with EEPROM
• SDRAM internal banks : four banks
• Module bank : one physical bank
• Auto refresh and self refresh
• 1.15” (29.21mm) Height PCB with single sided com- • 4096 refresh cycles / 64ms
ponents
• Programmable Burst Length and Burst Type
• Single 3.3±0.3V power supply
- 1, 2, 4 or 8 or Full page for Sequential Burst
• All device pins are compatible with LVTTL interface
- 1, 2, 4 or 8 for Interleave Burst
• Data mask function by DQM
• Programmable CAS Latency ; 2, 3 Clocks
ORDERING INFORMATION
Part No.
HYM71V16635BT8-K
HYM71V16635BT8-H
HYM71V16635BLT8-K
HYM71V16635BLT8-H
Clock
Frequency
Internal
Bank
133MHz
4 Banks
Ref.
4K
Power
Normal
Low Power
SDRAM
Package
Plating
TSOP-II
Gold
This document is a general product description and is subject to change without notice. Hynix Semiconductor Inc. does not assume any responsibility for
use of circuits described. No patent licenses are implied.
Rev. 0.1/Nov. 01
2

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SERIAL PRESENCE DETECT
PC133 SDRAM Unbuffered DIMM
HYM71V16635BT8 Series
BYTE
NUMBER
BYTE0
BYTE1
BYTE2
BYTE3
BYTE4
BYTE5
BYTE6
BYTE7
BYTE8
BYTE9
BYTE10
BYTE11
BYTE12
BYTE13
BYTE14
BYTE15
BYTE16
BYTE17
BYTE18
BYTE19
BYTE20
BYTE21
BYTE22
BYTE23
BYTE24
BYTE25
BYTE26
BYTE27
BYTE28
BYTE29
BYTE30
BYTE31
BYTE32
BYTE33
BYTE34
BYTE35
BYTE36
~61
BYTE62
BYTE63
BYTE64
BYTE65
~71
BYTE72
FUNCTION
DESCRIPTION
# of Bytes Written into Serial Memory at Module
Manufacturer
Total # of Bytes of SPD Memory Device
Fundamental Memory Type
# of Row Addresses on This Assembly
# of Column Addresses on This Assembly
# of Module Banks on This Assembly
Data Width of This Assembly
Data Width of This Assembly (Continued)
Voltage Interface Standard of This Assembly
SDRAM Cycle Time @/CAS Latency=3
Access Time from Clock @/CAS Latency=3
DIMM Configuration Type
Refresh Rate/Type
Primary SDRAM Width
Error Checking SDRAM Width
Minimum Clock Delay Back to Back Random Column
Address
Burst Lenth Supported
# of Banks on Each SDRAM Device
SDRAM Device Attributes, /CAS Lataency
SDRAM Device Attributes, /CS Lataency
SDRAM Device Attributes, /WE Lataency
SDRAM Module Attributes
SDRAM Device Attributes, General
SDRAM Cycle Time @/CAS Latency=2
Access Time from Clock @/CAS Latency=2
SDRAM Cycle Time @/CAS Latency=1
Access Time from Clock @/CAS Latency=1
Minimum Row Precharge Time (tRP)
Minimum Row Active to Row Active Delay (tRRD)
Minimum /RAS to /CAS Delay (tRCD)
Minimum /RAS Pulse Width (tRAS)
Module Bank Density
Command and Address Signal Input Setup Time
Command and Address Signal Input Hold Time
Data Signal Input Setup Time
Data Signal Input Hold Time
Superset Information (may be used in future)
SPD Revision
Checksum for Byte 0~62
Manufacturer JEDEC ID Code
....Manufacturer JEDEC ID Code
Manufacturing Location
FUNCTION
-K -H
128 Bytes
256 Bytes
SDRAM
12
10
1 Bank
64 Bits
-
LVTTL
7.5ns
7.5ns
5.4ns
5.4ns
None
15.625us
/ Self Refresh Supported
x8
None
tCCD = 1 CLK
1,2,4,8,Full Page
4 Banks
/CAS Latency=2,3
/CS Latency=0
/WE Latency=0
Neither Buffered nor Registered
+/- 10% voltage tolerence, Burst Read
Single Bit Write, Precharge All, Auto
Precharge, Early RAS Precharge
7.5s 10ns
5.4ns
6ns
--
--
15ns
20ns
15ns
15ns
15ns
20ns
45ns
45ns
128MB
1.5ns
1.5ns
0.8ns
0.8ns
1.5ns
1.5ns
0.8ns
0.8ns
-
Intel SPD 1.2B
-
Hynix JEDED ID
Unused
HSI (Korea Area)
HSA (United States Area)
HSE (Europe Area)
HSJ (Japan Area)
HSS(Singapore)
ASIA Area
Rev. 0.1/Nov. 01
VALUE
-K -H
80h
08h
04h
0Ch
0Ah
01h
40h
00h
01h
75h 75h
54h 54h
00h
80h
08h
00h
01h
8Fh
04h
06h
01h
01h
00h
0Eh
75h A0h
54h 60h
00h 00h
00h 00h
0Fh 14h
0Fh 0Fh
0Fh 14h
2Dh 2Dh
20h
15h 15h
08h 08h
15h 15h
08h 08h
00h
12h
6Eh AFh
ADh
FFh
0*h
1*h
2*h
3*h
4*h
5*h
NOTE
1
2
3, 8
11
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AC CHARACTERISTICS II
Parameter
Symbol
RAS Cycle Time
Operation
Auto Refresh
tRC
tRRC
RAS to CAS Delay
tRCD
RAS Active Time
tRAS
RAS Precharge Time
tRP
RAS to RAS Bank Active Delay
tRRD
CAS to CAS Delay
tCCD
Write Command to Data-In Delay
tWTL
Data-In to Precharge Command
tDPL
Data-In to Active Command
tDAL
DQM to Data-Out Hi-Z
tDQZ
DQM to Data-In Mask
tDQM
MRS to New Command
tMRD
Precharge to Data CAS Latency = 3 tPROZ3
Output Hi-Z
CAS Latency = 2 tPROZ2
Power Down Exit Time
tPDE
Self Refresh Exit Time
tSRE
Refresh Time
tREF
-K
Min
60
60
15
45
15
15
1
0
2
4
2
0
2
3
2
1
1
-
Note :
1. A new command can be given tRRC after self refresh exit
Max
-
-
-
100K
-
-
-
-
-
-
-
-
-
-
-
-
-
64
PC133 SDRAM Unbuffered DIMM
HYM71V16635BT8 Series
-H
Min Max
65 -
65 -
20 -
45 100K
20 -
15 -
1-
0-
2-
5-
2-
0-
2-
3-
2-
1-
1-
- 64
Unit Note
ns
ns
ns
ns
ns
ns
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
CLK
ms
1
Rev. 0.1/Nov. 01
12

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