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Número de pieza | EClamp2455K | |
Descripción | ESD/EMI Protection | |
Fabricantes | Semtech Corporation | |
Logotipo | ||
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PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM2455K is combination EMI filter and line
termination device with integrated TVS diodes for use on
SIM Card interfaces on cellular phones and other por-
table electronics. This state-of-the-art device utilizes
solid-state silicon-avalanche technology for superior
clamping performance and DC electrical characteristics.
The device consists of three circuits that include series
impedance matching resistors for proper termination of
the SIM card interface. Termination resistor value of
100 Ohms is included on the RST and Data lines and 47
Ohms on the CLK line. TVS diodes are also included on
each line for ESD protection in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4. An additional TVS diode connection is
included for protection of the voltage (Vcc) bus.
The EClamp2455K is in a 8-pin, RoHS/WEEE compli-
ant, SLP1713P8 package. It measures 1.7 x 1.3 x
0.50mm. The leads are spaced at a pitch of 0.4mm
and are finished with lead-free NiPdAu. The small
package makes it ideal for use in portable electronics
such as cell phones and digital still cameras.
Features
EClamp2455K
ESD/EMI Protection
for SIM Card
PRELIMINARY
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
TVS working voltage: 5V
Termination Resistors: 100 Ohms & 47 Ohms
Capacitance: 20pF (Typical at VR = 0V)
Protection and filtering for four lines
Solid-state technology
Mechanical Characteristics
SLP1713P8 8-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 1.7 x 1.3 x 0.50 mm
Lead Pitch: 0.4mm
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
Applications
SIM Card
Cell Phone
PDAs and Smartphones
Pin Configuration
Package Configuration
RST Out 1
CLK Out
Data Out
NC 4
8 RST In
CLK In
Gnd
Data In
5 Vcc
Pin Identification and Configuration
(Top Side View)
Revision 03/27/2007
1.70
12
1.30
0.40 BSC
0.50
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1 www.semtech.com
1 page PROTECTION PRODUCTS
Device Connection
The EClamp2455K designed with ease of layout in
mind. The package has flow through design which
allows the designer to route the signals straight in and
out between the SIM port connector and the SIM
controller. The device is in a 8-pin SLP package.
Electrical connection is made to the 8 pins located at
the bottom of the device. A center tab serves as the
ground connection. Pin connections are noted in
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces.
EClamp2455K
PRELIMINARY
Figure 1 - Pin Identification and Configuration
(Top Side View)
RST Out 1
8 RST In
CLK Out
Data Out
CLK In
Gnd
Data In
NC 4
5 Vcc
RST OUT
CLK OUT
1
8
DATA OUT
Gnd
45
RST In
CLK IN
DATA IN
Vcc
EECClalammpp22445555PK
SIM Card
Connector
Reset
Clock
Data I/O
5V/3.3V/1.8V
© 2007 Semtech Corp.
Figure 2 - SIM Protection
5
www.semtech.com
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet EClamp2455K.PDF ] |
Número de pieza | Descripción | Fabricantes |
EClamp2455K | ESD/EMI Protection | Semtech Corporation |
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