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PDF EClamp1002A Data sheet ( Hoja de datos )

Número de pieza EClamp1002A
Descripción ESD/EMI Protection
Fabricantes Semtech Corporation 
Logotipo Semtech Corporation Logotipo



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PROTECTION PRODUCTS - EMIClampTM
Description
The EClampTM1002A is a low pass filter array with
integrated TVS diodes for ESD protection. It is de-
signed to provide bidirectional filtering of EMI/RFI
signals and electrostatic discharge (ESD) protection in
portable electronic equipment. This state-of-the-art
device utilizes solid-state silicon-avalanche technology
for superior clamping performance and DC electrical
characteristics. They have been optimized for use on a
speaker port in cellular phones and other portable
electronics.
The EClamp1002A effectively replaces 10 discrete
components in a small SC-89 package to provide ESD
protection and EMI filtering. Each device requires less
than 2.9mm2 of PCB area with a low profile of only
0.60mm. This small package will protect and filter up
to two lines. This small outline makes the device
especially well suited for portable applications.
The TVS diodes are bidirectional for supporting bipolar
audio signals without distortion. The TVS diodes provide
effective suppression of ESD voltages in excess of 15kV
(air discharge) and 8kV (contact discharge) per IEC 61000-
4-2, level 4. The device has very low insertion loss in the
pass band (to approximately 10MHz) and high attenua-
tion at frequencies ranging from 800MHz to 3GHz. Each
line features two stages of TVS diode protection. They
feature large cross-sectional area junctions for conducting
high transient currents. They offer desirable characteris-
tics for board level protection including fast response time,
low operating and clamping voltage, and no device degra-
dation.
Dimensions
EClamp1002A
ESD/EMI Protection
for Speaker Ports
PRELIMINARY
Features
‹ Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
‹ Bidirectional EMI/RFI filter with integrated ESD
protection
‹ Protects two I/O lines
‹ Ultra-small SC-89 package (1.7 x 1.7 x 0.6mm)
requires less than 2.9mm2 of PCB area
‹ Working voltage: 5V
‹ Low leakage current
‹ Low operating and clamping voltages
‹ Solid-state silicon-avalanche technology
Mechanical Characteristics
‹ SC-89 (SOT-666) package
‹ RoHS/WEEE Compliant
‹ Lead Finish: Matte Tin
‹ Molding compound flammability rating: UL 94V-0
‹ Marking : Marking Code
‹ Weight: 2.9mg (typical)
‹ Packaging : Tape and Reel per EIA 481
Applications
‹ Cellular Handsets & Accessories
‹ Cordless Phones
‹ Personal Digital Assistants (PDA’s)
‹ Webpads & Handhelds
‹ Notebook
‹ Portable Instrumentation
‹ MP3 Players
Schematic & Pin Configuration
1.70
0.50
1.25 1.70
0.30
0.60
Revision 12/08/2005
SC-89 (Top View)
1 www.semtech.com

1 page




EClamp1002A pdf
PROTECTION PRODUCTS
Outline Drawing- SC-89 (SOT-666)
D
A
N
E1
D
E/2
E
12
e
B
Nxb
aaa C A-B D
L1
EClamp1002A
PRELIMINARY
L
c
DIMENSIONS
DIM
INCHES
MIN NOM MAX
MILLIMETERS
MIN NOM MAX
A .019 - .024 0.50 - 0.60
b .005 - .012 0.15 - 0.30
c .003 - .007 0.10 - 0.18
D .059 .063 .067 1.50 1.60 1.70
E .061 .063 .067 1.55 1.60 1.70
E1 .043 .047 .049 1.10 1.20 1.25
e .020 BSC
0.50 BSC
L .003 .008 .012 0.10 0.20 0.30
L1 .003 .006 .008 0.10 0.15 0.20
N6
6
aaa .004
0.10
A
C
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
Land Pattern- SC-89 (SOT-666)
X
Z CG
Y DIMENSIONS
DIM INCHES MILLIMETERS
C (.057)
(1.45)
P .020
0.50
G .024
0.60
X .012
0.30
Y .033
0.85
Y Z .090
2.30
P
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET
2005 Semtech Corp.
5
www.semtech.com

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