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PDF HYMP112S64MP8 Data sheet ( Hoja de datos )

Número de pieza HYMP112S64MP8
Descripción DDR2 SDRAM SO-DIMM
Fabricantes Hynix Semiconductor 
Logotipo Hynix Semiconductor Logotipo



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No Preview Available ! HYMP112S64MP8 Hoja de datos, Descripción, Manual

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Revision History
No. History
0.1
1) Defined target spec.
2) Corrected Pin assignment table
128Mx64 bits
DDR2 SDRAM SO-DIMM
HYMP112S64(L)MP8
Date
July 2004
Remark
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 0.1/ July 2004
1

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HYMP112S64MP8 pdf
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HYMP112S64(L)MP8
FUNCTIONAL BLOCK DIAGRAM
CKE1
ODT1
/S1
CKE0
ODT0
/S0
3Ω+/− 5%
DQS0
/DQS0
DM0
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQS
/DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS0 ODT0 CKE0 /CS1 ODT1 CKE1
D0,D8(DDP)
DQS1
/D Q S 1
DM1
DQS2
/D Q S 2
DM2
DQS3
/D Q S 3
DM3
DQ8
DQ8
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQS
/DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS0 ODT0 CKE0 /CS1 ODT1 CKE1
D1,D9(DDP)
DQS
/DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS0 ODT0 CKE0 /CS1 ODT1 CKE1
D2,D10(DDP)
DQS
/DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS0 ODT0 CKE0 /CS1 ODT1 CKE1
D3,D11(DDP)
DQS4
/DQS4
DM4
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQS5
/D Q S 5
DM5
DQS6
/D Q S 6
DM6
DQS7
/D Q S 7
DM7
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
DQS
/DQS
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
/CS0 ODT0 CKE0 /CS1 ODT1 CKE1
D4,D12(DDP)
DQS /CS0 ODT0 CKE0 /CS1 ODT1 CKE1
/DQS
DM
I/O 0
I/O 1 D5,D13(DDP)
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS /CS0 ODT0 CKE0 /CS1 ODT1 CKE1
/DQS
DM
I/O 0
I/O 1
I/O 2
D6,D14(DDP)
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS /CS0 ODT0 CKE0 /CS1 ODT1 CKE1
/DQS
DM
I/O 0
I/O 1 D7,D15(DDP)
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
BA0-BA2
A0-AN
/RAS
/CAS
/WE
3+/- 5%
SDRAMS D0-15
SDRAMS D0-15
SDRAMS D0-15
SDRAMS D0-15
SDRAMS D0-15
CK0
/CK0
CK1
/CK1
4 loads
4 loads
VDD SPD
VREF
VDD
VSS
SCL
SA0
SA1
SCL
A0
A1
A2
SDA
Serial PD
WP
SDA
Notes :
1. Unless otherwise noted, resistor values are 22 ± 5%
2. DQ wring may differ form that described in this drawing; however ,
DQ,DM,DQS,/DQS relationships are maintained as shown.
Serial PD
SDRAMS DO-D15
SDRAMS DO-D15, VDD and VDDQ
SDRAMS DO-D15, SPD
Rev. 0.1/ July 2004
5

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HYMP112S64MP8 arduino
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IDD Meauarement Conditions
HYMP112S64(L)MP8
Symbol
IDD0
IDD1
IDD2P
IDD2Q
IDD2N
IDD3P
IDD3N
IDD4W
IDD4R
IDD5B
IDD6
IDD7
Conditions
Operating one bank active-precharge current; tCK = tCK(IDD), tRC = tRC(IDD), tRAS = tRAS-
min(IDD);CKE is HIGH, CS is HIGH between valid commands;Address bus inputs are SWITCHING;Data bus
inputs are SWITCHING
Operating one bank active-read-precharge curren ; IOUT = 0mA;BL = 4, CL = CL(IDD), AL = 0;
tCK = tCK(IDD), tRC = tRC (IDD), tRAS = tRASmin(IDD), tRCD = tRCD(IDD) ; CKE is HIGH, CS is HIGH
between valid commands ; Address bus inputs are SWITCHING ; Data pattern is same as IDD4W
Precharge power-down current ; All banks idle ; tCK = tCK(IDD) ; CKE is LOW ; Other control and address
bus inputs are STABLE; Data bus inputs are FLOATING
Precharge quiet standby current;All banks idle; tCK = tCK(IDD);CKE is HIGH, CS is HIGH; Other control
and address bus inputs are STABLE; Data bus inputs are FLOATING
Precharge standby current; All banks idle; tCK = tCK(IDD); CKE is HIGH, CS is HIGH; Other control and
address bus inputs are SWITCHING; Data bus inputs are SWITCHING
Active power-down current; All banks open; tCK = tCK(IDD); CKE is
LOW; Other control and address bus inputs are STABLE; Data bus inputs are
FLOATING
Fast PDN Exit MRS(12) = 0
Slow PDN Exit MRS(12) = 1
Active standby current; All banks open; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP =tRP(IDD); CKE is
HIGH, CS is HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus
inputs are SWITCHING
Operating burst write current; All banks open, Continuous burst writes; BL = 4, CL = CL(IDD), AL = 0;
tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid commands;
Address bus inputs are SWITCHING; Data bus inputs are SWITCHING
Operating burst read current; All banks open, Continuous burst reads, IOUT = 0mA; BL = 4, CL =
CL(IDD), AL = 0; tCK = tCK(IDD), tRAS = tRASmax(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between
valid commands; Address bus inputs are SWITCHING;; Data pattern is same as IDD4W
Burst refresh current; tCK = tCK(IDD); Refresh command at every tRFC(IDD) interval; CKE is HIGH, CS is
HIGH between valid commands; Other control and address bus inputs are SWITCHING; Data bus inputs are
SWITCHING
Self refresh current; CK and CK at 0V; CKE £ 0.2V; Other control and address bus inputs are FLOATING;
Data bus inputs are FLOATING
Operating bank interleave read current; All bank interleaving reads, IOUT = 0mA; BL = 4, CL = CL(IDD),
AL = tRCD(IDD)-1*tCK(IDD); tCK = tCK(IDD), tRC = tRC(IDD), tRRD = tRRD(IDD), tRCD = 1*tCK(IDD); CKE
is HIGH, CS is HIGH between valid commands; Address bus inputs are STABLE during DESELECTs; Data pat-
tern is same as IDD4R; - Refer to the following page for detailed timing conditions
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
Note:
1. IDD specifications are tested after the device is properly initialized
2. Input slew rate is specified by AC Parametric Test Condition
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, DQS, RDQS, RDQS, LDQS, LDQS, UDQS, and UDQS. IDD values must be met with all combinations
of EMRS bits 10 and 11.
5. Definitions for IDD
LOW is defined as Vin VILAC(max)
HIGH is defined as Vin VIHAC(min)
STABLE is defined as inputs stable at a HIGH or LOW level
FLOATING is defined as inputs at VREF = VDDQ/2
SWITCHING is defined as:
inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and control signals, and
inputs changing between HIGH and LOW every other data transfer (once per clock) for DQ signals not including masks or strobes.
Rev. 0.1/ July 2004
11

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