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PDF ICSSSTU32864 Data sheet ( Hoja de datos )
| Número de pieza | ICSSSTU32864 | |
| Descripción | 25-Bit Configurable Registered Buffer | |
| Fabricantes | ICS | |
| Logotipo |  |
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Integrated
Circuit
Systems, Inc.
ICSSSTU32864
25-Bit Configurable Registered Buffer
Recommended Application:
• DDR2 Memory Modules
• Provides complete DDR DIMM logic solution with
ICS97U877
Product Features:
• 25-bit 1:1 or 14-bit 1:2 configurable registered buffer
• Supports SSTL_18 JEDEC specification on data
inputs and outputs
• Supports LVCMOS switching levels on CSR# and
RESET# inputs
• Low voltage operation
VDD = 1.7V to 1.9V
• Available in 96 BGA package
Truth Table
I nputs
Outp uts
RST# DCS# CSR# CK
CK#
Dn,
DODT,
DCK E
Qn
QCS#
QODT,
QCKE
HLL
LL LL
HLL
HHL H
H
L
L L or H L or H X
Q0 Q0 Q0
HLH
LL LL
HLH
HHL H
H
L
H L or H L or H X
Q0 Q0 Q0
HHL
LL HL
HHL
HHHH
H
H
L L or H L or H X
Q0 Q0 Q0
HHH
L Q0 H L
HHH
H Q0 H H
H H H L or H L or H X Q0 Q0 Q0
L
X or X or X or X or X or
Floating Floating Floating Floating Floating
L
L
L
0727C—04/15/04
Pin Configuration
123456
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
96 Ball BGA
(Top View)
Ball Assignments
A DCKE
B D2
C D3
D DODT
E D5
F D6
G NC
H CK
J CK#
K D8
L D9
M D10
N D11
P D12
R D13
T D14
1
NC
D15
D16
NC
D17
D18
RST#
DCS#
CSR#
D19
D20
D21
D22
D23
D24
D25
2
V REF
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
V REF
3
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
GND
VDD
VDD
4
QCKE
Q2
Q3
NC
Q15
Q16
QODT NC
Q5 Q17
Q6 Q18
C1 C0
QCS#
ZOH
Q8
NC
ZOL
Q19
Q9 Q20
Q10 Q21
Q11 Q22
Q12 Q23
Q13 Q24
Q14 Q25
56
1:1 Register (C0 = 0, C1 = 0)
1 page  
ICSSSTU32864
Block Diagram for 1:2 mode (positive logic)
RST#
CK
CK#
VREF
DCKE
DODT
DCS#
CSR#
1D
C1
R
1D
C1
R
1D
C1
R
D1 0
1
0727C—04/15/04
To 10 Other Channels
*Note: Disabled in 1:1 configuration
5
1D
C1
R
QCKEA
QCKE B*
QODTA
QODTB*
QCSA#
QCSB#*
Q1A
Q1B*
5 Page 
ICSSSTU32864
Seating
Plane
C
A1 b
T REF
D
TOP VIEW
d TYP
D1
Numeric Designations
for Horizontal Grid
4 321
A
B
C
D
Alpha Designations
for Vertical Grid
(Letters I, O, Q & S
not used)
- e - TYP
E
hc
TYP
REF
- e - TYP
0.12 C
E1
ALL DIMENSIONS IN MILLIMETERS
D ET
Min/Max
----- BALL GRID -----
Max.
e
HORIZ
VERT
TOTAL
d
Min/Max
16.00 Bsc
13.50 Bsc
7.00 Bsc
5.50 Bsc
5.50 Bsc
4.50 Bsc
1.30/1.50
1.30/1.50
0.86/1.00
0.80 Bsc
0.80 Bsc
0.65 Bsc
6
6
6
19 114 0.40/0.50
16 96 0.40/0.50
10 60 0.35/0.45
Note: Ball grid total indicates maximum ball count for package. Lesser quantity may be used.
h
Min/Max
0.31/0.41
0.25/0.41
0.15/0.21
REF. DIMENSIONS
bc
0.80
0.75
0.575
0.75
0.75
0.625
10-0055C
* Source Ref.: JEDEC Publication 95, MO-205
Ordering Information
ICSSSTU32864yHT
Example:
ICS XXXX y H - T
0727C—04/15/04
Designation for tape and reel packaging
Package Type
H = BGA
Revision Designator (will not correlate with datasheet revision)
Device Type
Prefix
ICS = Standard Device
11
11 Page | ||
| Páginas | Total 11 Páginas | |
| PDF Descargar | [ Datasheet ICSSSTU32864.PDF ] | |
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