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PDF VSMF3710 Data sheet ( Hoja de datos )
| Número de pieza | VSMF3710 | |
| Descripción | High Speed Infrared Emitting Diode | |
| Fabricantes | Vishay Siliconix | |
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VSMF3710
Vishay Semiconductors
High Speed Infrared Emitting Diode, 890 nm
RoHS Compliant, Released for Lead (Pb)-free Solder Process
Description
VSMF3710 is a high speed infrared emitting diode in
GaAlAs double hetero (DH) technology in a miniature
PLCC-2 SMD package.
DH technology combines high speed with high radiant
power at wavelength of 890 nm.
Features
• High radiant power
• High speed: tr = 30 ns
• High modulation band width: fc = 12 MHz
• Peak wavelength: λp = 890 nm
• High reliability
e3
• Low forward voltage
• Suitable for high pulse current application
• Wide angle of half intensity
• Compatible with automatic placement equipment
• EIA and ICE standard package
• 8 mm tape and reel standard: GS08 or GS18
• Lead (Pb)-free reflow soldering
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
94 8553
Applications
• High speed IR data transmission
• High power emitter for low space applications
• High performance transmissive or reflective
sensors
Order Instructions
Part
VSMF3710
VSMF3710
Ordering code
VSMF3710-GS08
VSMF3710-GS18
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Reverse voltage
Forward current
Peak forward current
Surge forward current
tp/T = 0.5, tp = 100 µs
tp = 100 µs
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
acc. figure 8, J-STD-020B
Thermal resistance
junction / ambient
Remarks
MOQ: 7500 pcs, 1500 pcs per reel
MOQ: 8000 pcs, 8000 pcs per reel
Symbol
VR
IF
IFM
IFSM
PV
Tj
Tamb
Tstg
Tsd
RthJA
Value
5
100
200
1
170
100
- 40 to + 85
- 40 to + 100
260
400
Unit
V
mA
mA
A
mW
°C
°C
°C
°C
K/W
Document Number 81241
Rev. 1.5, 25-Jan-07
www.vishay.com
1
1 page  
VSMF3710
Vishay Semiconductors
Solder Profile
300
250
200
225555°C°C
240 °C
217 °C
150
max. 120 s
100
50 max. Ramp Up 3 °C/s
max. 260 °C
245 °C
max. 30 s
max. 100 s
max. Ramp Down 6 °C/s
0
0
19841
50 100 150 200 250 300
Time (s)
Figure 8. Lead (Pb)-free Reflow Solder Profile acc. J-STD-020B
for Preconditioning acc. to JEDEC, Level 2a
Tape and Reel
PLCC-2 components are packed in antistatic blister
tape (DIN IEC (CO) 564) for automatic component
insertion. Cavities of blister tape are covered with
adhesive tape.
Adhesive Tape
Blister Tape
TTW Soldering (acc. to CECC00802)
948626-1
300
5s
Lead Temperature
250
235 °C...260 °C
first wave
200
second
wave
full line: typical
dotted line: process limits
ca. 2 K/s
ca. 200 K/s
150
100 °C...130 °C
100
50
0
0
2 K/s
forced cooling
ca. 5 K/s
50 100 150 200
Time (s)
250
Figure 9. Double Wave Solder Profile for Opto Components
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a des-
iccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated on MBB
label:
Floor Life: 4 weeks
Conditions: Tamb < 30 °C, RH < 60 %
Moisture Sensitivity Level 2a, acc. to J-STD-020B.
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (+ 5 °C), RH < 5 %.
Component Cavity
Figure 10. Blister Tape
94 8670
3.5 2.2
3.1 2.0
5.75
5.25
3.6 8.3
3.4 7.7
4.0
3.6
1.85
1.65
1.6 4.1
1.4 3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Figure 11. Tape Dimensions in mm for PLCC-2
Document Number 81241
Rev. 1.5, 25-Jan-07
www.vishay.com
5
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| PDF Descargar | [ Datasheet VSMF3710.PDF ] | |
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